DLPS029F April   2013  – May 2019 DLPC350


  1. Features
  2. Applications
  3. Description
    1.     Simplified Application
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
    2. Table 1. Power and Ground Pin Descriptions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  I/O Electrical Characteristics
    6. 6.6  I2C0 and I2C1 Interface Timing Requirements
    7. 6.7  Port 1 Input Pixel Interface Timing Requirements
    8. 6.8  Port 2 Input Pixel Interface (FPD-Link Compatible LVDS Input) Timing Requirements
    9. 6.9  System Oscillator Timing Requirements
    10. 6.10 Reset Timing Requirements
    11. 6.11 Video Timing Input Blanking Specification
      1. 6.11.1 Source Input Blanking
    12. 6.12 Programmable Output Clocks Switching Characteristics
    13. 6.13 DMD Interface Switching Characteristics
    14. 6.14 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. Parameter Measurement Information
    1. 7.1 Power Consumption
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Board Level Test Support
    4. 8.4 Device Functional Modes
      1. 8.4.1 Structured Light Applications
      2. 8.4.2 (LVDS) Receiver Supported Pixel Mapping Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Chipset Application
        1. Design Requirements
        2. Detailed Design Procedure
          1. DLPC350 System Interfaces
            1. Control Interface
            2. Input Data Interface
          2. DLPC350 System Output Interfaces
            1. Illumination Interface
            2. Trigger Interface (Sync Outputs)
          3. DLPC350 System Support Interfaces
            1. Reference Clock
            2. PLL
            3. Program Memory Flash Interface
          4. DMD Interfaces
            1. DLPC350 to DMD Digital Data
            2. DLPC350 to DMD Control Interface
            3. DLPC350 to DMD Micromirror Reset Control Interface
  10. 10Power Supply Recommendations
    1. 10.1 System Power and Reset
      1. 10.1.1 Default Conditions
        1. 1.2-V System Power
        2. 1.8-V System Power
        3. 1.9-V System Power
        4. 3.3-V System Power
        5. FPD-Link Input LVDS System Power
      2. 10.1.2 System Power-up and Power-down Sequence
      3. 10.1.3 Power-On Sense (POSENSE) Support
      4. 10.1.4 Power-Good (PWRGOOD) Support
      5. 10.1.5 5-V Tolerant Support
      6. 10.1.6 Power Reset Operation
      7. 10.1.7 System Reset Operation
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 DMD Interface Design Considerations
      2. 11.1.2 DMD Termination Requirements
      3. 11.1.3 Decoupling Capacitors
      4. 11.1.4 Power Plane Recommendations
      5. 11.1.5 Signal Layer Recommendations
      6. 11.1.6 General Handling Guidelines for CMOS-Type Pins
      7. 11.1.7 PCB Manufacturing
        1. General Guidelines
        2. Trace Widths and Minimum Spacings
        3. Routing Constraints
        4. Fiducials
        5. Flex Considerations
        6. DLPC350 Thermal Considerations
    2. 11.2 Layout Example
      1. 11.2.1 Printed Circuit Board Layer Stackup Geometry
      2. 11.2.2 Recommended DLPC350 MOSC Crystal Oscillator Configuration
      3. 11.2.3 Recommended DLPC350 PLL Layout Configuration
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Video Timing Parameter Definitions
      2. 12.1.2 Device Nomenclature
      3. 12.1.3 Device Marking
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

System Power-up and Power-down Sequence

Although the DLPC350 controller requires an array of power supply voltages, (for example, VDDC, VDD_1X_PLLX, VCC_18, VCC_DMD, and VCCXX_FPD), there are no restrictions regarding the relative order of power supply sequencing to avoid damaging the DLPC350 controller. This is true for both power-up and power-down. Similarly, there is no minimum time between powering-up or powering-down the different supplies of the DLPC350 controller. Note that it is not uncommon for there to be power-sequencing requirements for other devices that share power supplies with the DLPC350 controller.

Although there is no risk of damaging the DLPC350 controller as a result of a given power sequence, from a functional standpoint there are a few specific power-sequencing recommendations to ensure proper operation.

  • 1.2-V core power should be applied whenever any I/O power is applied. This ensures that the powered I/O pins are set to a known state. Thus, TI recommends that core power be applied first. Other supplies should be applied only after the 1.2-V DLPC350 core has ramped up.
  • All controller power should be applied before POSENSE is asserted to ensure proper power-up initialization is performed. 1.8-V PLL power, 1.9-V I/O power, and 3.3-V I/O power should remain applied as long as 1.2-V core power is applied and POSENSE is asserted.

It is assumed that all DLPC350 power-up sequencing is handled by external hardware. It is also assumed that an external power monitor will hold the DLPC350 controller in system reset during power-up (that is, POSENSE = 0). It should continue to assert system reset until all DLPC350 voltages have reached minimum specified voltage levels. During this time, all controller I/O are either 3-stated or driven low. The master PLL (PLLM) is released from reset upon the low-to-high transition of POSENSE, but the DLPC350 controller keeps the rest of the controller in reset for an additional 100 ms to allow the PLL to lock and stabilize its outputs. After this 100-ms delay, internal resets are de-asserted causing the microprocessor to begin its boot-up routine.

DLPC350 Power_Timing_DLPS029.pngFigure 22. Power-up and Power-down Timing