SNLS638B December   2018  â€“ January 2025 DP83825I

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1.     DP83825I Pin Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Auto-Negotiation (Speed / Duplex Selection)
      2. 6.3.2  Auto-MDIX Resolution
      3. 6.3.3  Energy Efficient Ethernet
        1. 6.3.3.1 EEE Overview
        2. 6.3.3.2 EEE Negotiation
      4. 6.3.4  EEE for Legacy MACs Not Supporting 802.3az
      5. 6.3.5  Wake-on-LAN Packet Detection
        1. 6.3.5.1 Magic Packet Structure
        2. 6.3.5.2 Magic Packet Example
        3. 6.3.5.3 Wake-on-LAN Configuration and Status
      6. 6.3.6  Low Power Modes
        1. 6.3.6.1 Active Sleep
      7. 6.3.7  IEEE Power Down
      8. 6.3.8  Deep Power Down
      9. 6.3.9  Reduced Media Independent Interface (RMII)
      10. 6.3.10 RMII Repeater Mode
      11. 6.3.11 Serial Management Interface
        1. 6.3.11.1 Extended Register Space Access
        2. 6.3.11.2 Read Operation
        3. 6.3.11.3 Write Operation
      12. 6.3.12 100BASE-TX
        1. 6.3.12.1 100BASE-TX Transmitter
          1. 6.3.12.1.1 Code-Group Encoding and Injection
          2. 6.3.12.1.2 Scrambler
          3. 6.3.12.1.3 NRZ to NRZI Encoder
          4. 6.3.12.1.4 Binary to MLT-3 Converter
        2. 6.3.12.2 100BASE-TX Receiver
      13. 6.3.13 10BASE-Te
        1. 6.3.13.1 Squelch
        2. 6.3.13.2 Normal Link Pulse Detection and Generation
        3. 6.3.13.3 Jabber
        4. 6.3.13.4 Active Link Polarity Detection and Correction
      14. 6.3.14 Loopback Modes
        1. 6.3.14.1 MII Loopback
        2. 6.3.14.2 PCS Loopback
        3. 6.3.14.3 Digital Loopback
        4. 6.3.14.4 Analog Loopback
        5. 6.3.14.5 Reverse Loopback
      15. 6.3.15 BIST Configurations
      16. 6.3.16 Cable Diagnostics
        1. 6.3.16.1 TDR
        2. 6.3.16.2 Fast Link-Drop Functionality
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
      1. 6.5.1 Straps Configuration
        1. 6.5.1.1 Straps for PHY Address
    6. 6.6 Device Registers
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Clock Requirements
          1. 7.2.1.1.1 Oscillator
          2. 7.2.1.1.2 Crystal
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 RMII Layout Guidelines
        2. 7.2.2.2 MDI Layout Guidelines
        3. 7.2.2.3 TPI Network Circuit
        4. 7.2.2.4 VOD Configuration
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Signal Traces
        2. 7.4.1.2 Return Path
        3. 7.4.1.3 Transformer Layout
          1. 7.4.1.3.1 Transformer Recommendations
        4. 7.4.1.4 Capacitive DC Blocking
        5. 7.4.1.5 Metal Pour
        6. 7.4.1.6 PCB Layer Stacking
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Timing Requirements

PARAMETERMINNOMMAXUNIT
POWER-UP TIMING
T1Voltage Ramp Duration ( 0 to 100% VDDIO)(1)0.5 40ms
T2Supply Sequencing: VDDIO shall ramp first and then AVDD0200ms
T3Voltage Ramp Duration ( 0 to 100% of AVDD)0.5 40ms
T4POR release time / Powerup to SMI ready: Post power-up stabilization time prior to MDC preamble for register access50ms
T5Powerup to FLP1500ms
Pedestal Voltage on AVDD, VDDIO before Power Ramp0.3V
All inputs must not be driven low or high until AVDD and VDDIO are stable
RESET TIMING
T1RESET PULSE Width: Miminum Reset pulse width to be able to reset (w/o debouncing caps)25us
T2Reset to SMI ready: Post reset stabilization time prior to MDC preamble for register access2ms
T3Reset to FLP1500ms
Reset to 100M signaling (strapped mode)0.5ms
Reset to RMII Master clock0.2ms
100M EEE TIMING
Sleep time (Ts)210us
Quiet time (Tq)20ms
Refresh time (Tr)200us
Wake time (Tw_sys_tx)36us
RMII TRANSMIT TIMING

T1

RMII Master Clock Period20ns
RMII Master Clock Duty Cycle35

65

%
T2TX_D[1:0], TX_ER, TX_EN Setup to RMII Master Clock4ns
T3TX_D[1:0], TX_ER, TX_EN Hold from RMII Master Clock

2

ns
RMII RECEIVE TIMING
T1Input Reference Clock Period

20

ns

Reference Clock Duty Cycle

3565%
T2RX_D[1:0], RX_ER, RX_DV Hold from XI Clock rising

2

ns
SMI TIMING
T1MDC to MDIO (Output) Delay Time010ns
T2MDIO (Input) to MDC Setup Time10ns
T3MDIO (Input) to MDC Hold Time10ns
T4MDC Frequency2.520MHz
OUTPUT CLOCK TIMING (50M RMII Master Clock)
Frequency (PPM)-5050ppm
Duty Cycle3565%
Rise time4000ps
 Fall Time4000ps
Jitter (Long Term)450ps
RefCLK to clock out delay with multiple resets40ns
INPUT CLOCK tolerance
25MHzFrequency Tolerance -5050ppm
Rise / Fall Time5ns
Jitter Tolerance (Accumulated over 100,000 cycles)1.75ns
Duty Cycle4060%
input phase noise at 1KHz-98dBc/Hz
input phase noise at 10KHz-113dBc/Hz
input phase noise at 100KHz-113dBc/Hz
input phase noise at 1MHz-113dBc/Hz
input phase noise at 10MHz-113dBc/Hz
50MHzFrequency Tolerance -5050ppm
Rise / Fall Time5ns
Jitter Tolerance (Accumulated over 100,000 cycles)1.75ns
Duty Cycle4060%
input phase noise at 1KHz-87dBc/Hz
input phase noise at 10KHz-107dBc/Hz
input phase noise at 100KHz-107dBc/Hz
input phase noise at 1MHz-107dBc/Hz
input phase noise at 10MHz-107dBc/Hz
LATENCY TIMING
TxSlave RMII Rising edge XI clock with assertion TX_EN to SSD symbol on MDI (100M)105ns
Master RMII Rising edge clock with assertion TX_EN to SSD symbol on MDI (100M)105ns
Slave RMII Rising edge XI clock with assertion TX_EN to SSD symbol on MDI (10M)1350ns
Master RMII Rising edge clock with assertion TX_EN to SSD symbol on MDI (10M)1300ns
RxSSD symbol on MDI to Slave RMII Rising edge of XI clock with assertion of CRS_DV (100M)350ns
SSD symbol on MDI to Master RMII Rising edge of Master clock with assertion of CRS_DV (100M)325ns
SSD symbol on MDI to Slave RMII Rising edge of XI clock with assertion of CRS_DV (10M)2150ns
SSD symbol on MDI to Master RMII Rising edge of Master clock with assertion of CRS_DV (10M)2150ns
Clock shall be available at power ramp. If Clock is provided after power ramp, external Reset of PHY is needed once clock is available