SLVSDX8B March   2017  – December 2018 DRV8702D-Q1 , DRV8703D-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Bridge Control
        1. 7.3.1.1 Logic Tables
      2. 7.3.2  MODE Pin
      3. 7.3.3  nFAULT Pin
      4. 7.3.4  Current Regulation
      5. 7.3.5  Amplifier Output (SO)
        1. 7.3.5.1 SO Sample and Hold Operation
      6. 7.3.6  PWM Motor Gate Drivers
        1. 7.3.6.1 Miller Charge (QGD)
      7. 7.3.7  IDRIVE Pin (DRV8702D-Q1 Only)
      8. 7.3.8  Dead Time
      9. 7.3.9  Propagation Delay
      10. 7.3.10 Overcurrent VDS Monitor
      11. 7.3.11 VDS Pin (DRV8702D-Q1 Only)
      12. 7.3.12 Charge Pump
      13. 7.3.13 Gate Drive Clamp
      14. 7.3.14 Protection Circuits
        1. 7.3.14.1 VM Undervoltage Lockout (UVLO2)
        2. 7.3.14.2 Logic Undervoltage (UVLO1)
        3. 7.3.14.3 VCP Undervoltage Lockout (CPUV)
        4. 7.3.14.4 Overcurrent Protection (OCP)
        5. 7.3.14.5 Gate Driver Fault (GDF)
        6. 7.3.14.6 Thermal Shutdown (TSD)
        7. 7.3.14.7 Watchdog Fault (WDFLT, DRV8703D-Q1 Only)
        8. 7.3.14.8 Reverse Supply Protection
      15. 7.3.15 Hardware Interface
        1. 7.3.15.1 IDRIVE (6-level input)
        2. 7.3.15.2 VDS (6-Level Input)
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 SPI Communication
        1. 7.5.1.1 Serial Peripheral Interface (SPI)
        2. 7.5.1.2 SPI Format
    6. 7.6 Register Maps
      1. 7.6.1 DRV8703D-Q1 Memory Map
      2. 7.6.2 Status Registers
        1. 7.6.2.1 FAULT Status Register (address = 0x00h)
          1. Table 15. FAULT Status Field Descriptions
        2. 7.6.2.2 VDS and GDF Status Register Name (address = 0x01h)
          1. Table 16. VDS and GDF Status Field Descriptions
      3. 7.6.3 Control Registers
        1. 7.6.3.1 Main Control Register Name (address = 0x02h)
          1. Table 18. Main Control Field Descriptions
        2. 7.6.3.2 IDRIVE and WD Control Register Name (address = 0x03h)
          1. Table 19. IDRIVE and WD Field Descriptions
        3. 7.6.3.3 VDS Control Register Name (address = 0x04h)
          1. Table 21. VDS Control Field Descriptions
        4. 7.6.3.4 Config Control Register Name (address = 0x05h)
          1. Table 22. Config Control Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External FET Selection
        2. 8.2.2.2 IDRIVE Configuration
        3. 8.2.2.3 VDS Configuration
        4. 8.2.2.4 Current Chopping Configuration
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance Sizing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power supply voltage VM –0.3 47 V
Charge pump voltage VCP, CPH –0.3 VVM + 12 V
Charge pump negative switching pin CPL –0.3 VVM V
Internal logic regulator voltage DVDD –0.3 3.8 V
Internal analog regulator voltage AVDD –0.3 5.7 V
Drain pin voltage VDRAIN –0.3 47 V
Voltage difference between supply and VDRAIN VM – VDRAIN –10 10 V
Control pin voltage VIN1, IN2, nSLEEP, nFAULT, VREF, IDRIVE, VDS, MODE, nSCS, SCLK, SDI, SDO, nWDFLT –0.3 5.75 V
High-side gate pin voltage GH –0.3 VVM + 12 V
Low-side gate pin voltage GL –0.3 12 V
Continuous phase-node pin voltage SH –1.2 VVM + 1.2 V
Pulsed 10-µs phase-node pin voltage SH –2 VVM + 2 V
Continuous shunt amplifier input pin voltage SP –0.5 1.2 V
SN –0.3 0.3 V
Pulsed 10-µs shunt amplifier input pin voltage SP –1 1.2 V
Shunt amplifier output pin voltage SO –0.3 5.75 V
Shunt amplifier output pin current SO 0 5 mA
Maximum current, limit current with external series resistor VDRAIN –2 2 mA
Open-drain output current nFAULT, SDO, nWDFLT 0 10 mA
Gate pin source current GH, GL 0 250 mA
Gate pin sink current GH, GL 0 500 mA
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.