SLLSES1E December   2015  – July 2025 HD3SS3220 , HD3SS3220L

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1 Cables, Adapters, and Direct Connect Devices
        1. 6.1.1.1 USB Type-C receptacles and Plugs
        2. 6.1.1.2 USB Type-C Cables
        3. 6.1.1.3 Legacy Cables and Adapters
        4. 6.1.1.4 Direct Connect Device
        5. 6.1.1.5 Audio Adapters
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  DFP/Source – Downstream Facing Port
      2. 6.3.2  UFP/Sink – Upstream Facing Port
      3. 6.3.3  DRP – Dual Role Port
      4. 6.3.4  Cable Orientation and Mux Control
      5. 6.3.5  Type-C Current Mode
      6. 6.3.6  Accessory Support
      7. 6.3.7  Audio Accessory
      8. 6.3.8  Debug Accessory
      9. 6.3.9  VCONN support for Active Cables
      10. 6.3.10 I2C and GPIO Control
      11. 6.3.11 HD3SS3220 V(BUS) Detection
      12. 6.3.12 VDD5 and VCC33 Power-On Requirements
    4. 6.4 Device Functional Modes
      1. 6.4.1 Unattached Mode
      2. 6.4.2 Active Mode
      3. 6.4.3 Dead Battery
      4. 6.4.4 Shutdown Mode
    5. 6.5 Programming
    6. 6.6 Register Maps
      1. 6.6.1 Device Identification Register (offset = 0x07 through 0x00) [reset = 0x00, 0x54, 0x55, 0x53, 0x42, 0x33, 0x32, 0x32]
      2. 6.6.2 Connection Status Register (offset = 0x08) [reset = 0x00]
      3. 6.6.3 Connection Status and Control Register (offset = 0x09) [reset = 0x20]
      4. 6.6.4 General Control Register (offset = 0x0A) [reset = 0x00]
      5. 6.6.5 Device Revision Register (offset = 0xA0) [reset = 0x02]
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application, DRP Port
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Typical Application, DFP Port
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
      4. 7.2.4 Typical Application, UFP Port
        1. 7.2.4.1 Design Requirements
        2. 7.2.4.2 Detailed Design Procedure
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Suggested PCB Stackups
      2. 9.1.2 High-Speed Signal Trace Length Matching
      3. 9.1.3 Differential Signal Spacing
      4. 9.1.4 High-Speed Differential Signal Rules
      5. 9.1.5 Symmetry in the Differential Pairs
      6. 9.1.6 Via Discontinuity Mitigation
      7. 9.1.7 Surface-Mount Device Pad Discontinuity Mitigation
      8. 9.1.8 ESD/EMI Considerations
    2. 9.2 Layout
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Trademarks
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.1 Design Requirements

For this design example, use the parameters shown in Table 7-1.

Table 7-1 Design Parameters, DRP Port
PARAMETEREXAMPLECOMMENTS
VDD55.25VVDD5 is used to provide VCONN power to CC pins. Value of this supply should be ≥ 5V to keep VCONN ≥ 4.75V.
System_VBUS5.25VVDD5 and System_VBUS can be shorted together; however careful consideration is needed to maintain desired VBUS and VCONN for the Type-C port.
I2C I/O Supply3.3V1.8V is also an option.
When using the 3.3V supply, the customer must ensure that the VDD5 is 3V and above. Otherwise the I2C may back power the device
VCC333.3V3-3.6V range allowed.
AC Coupling Capacitors for SS signals100nF75-200nF range allowed.
For TX pairs only, RX pairs will be biased by host Receiver. Note that HD3SS3220 requires a common mode biasing of 0-2V. If host receiver has bias voltage outside this range, appropriate additional ac coupling caps and biasing of HD3SS3220 RX pairs needed.
Pull-up Resistors: DIR, ID, INT_N, VCONN_FAULT_N200KSmaller values can be used, but leakage needs to be considered for device power budget calculations.
Pull-up Resistors: I2C4.7K
Pull-up Resistors: CURRENT_MODE10KExample here is for 3A. If 1.5A or 900mA needed different values are required.
Series resistor: VBUS_DET900K
Decoupling Capacitors: VCONN Bulk100μF
Decoupling Capacitors: VBUS Bulk150μFAs indicated in schematic needs to be switched out when in UFP.