SNAS758A February   2025  – June 2025 HDC3120

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power-Up
      2. 7.3.2 Device Disable and Enable
      3. 7.3.3 Conversion of the Signal Output
        1. 7.3.3.1 Relative Humidity (RH%) Measurement
        2. 7.3.3.2 Temperature Measurement
      4. 7.3.4 NIST Traceability and Unique ID
      5. 7.3.5 Output Short Circuit Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 On-Chip Heater
        1. 7.4.1.1 Operating Principle
          1. 7.4.1.1.1 Heater Configuration Example
        2. 7.4.1.2 Heater Electrical Behavior
        3. 7.4.1.3 Heater Temperature Increase
        4. 7.4.1.4 Heater Usage Guidelines
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Rehydration Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
    6. 8.6 Storage and PCB Assembly
      1. 8.6.1 Storage and Handling
      2. 8.6.2 Product Storage
      3. 8.6.3 PCB Assembly Flow
      4. 8.6.4 Rework Consideration
      5. 8.6.5 Sensitivity to Chemicals and Vapors
      6. 8.6.6 Exposure to High Temperature and High Humidity Conditions
      7. 8.6.7 Recovering Sensor Performance: Bake and Rehydration Procedure
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DEF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5 Electrostatic Discharge Caution

HDC3120 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.