SNAS758A February   2025  – June 2025 HDC3120

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power-Up
      2. 7.3.2 Device Disable and Enable
      3. 7.3.3 Conversion of the Signal Output
        1. 7.3.3.1 Relative Humidity (RH%) Measurement
        2. 7.3.3.2 Temperature Measurement
      4. 7.3.4 NIST Traceability and Unique ID
      5. 7.3.5 Output Short Circuit Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 On-Chip Heater
        1. 7.4.1.1 Operating Principle
          1. 7.4.1.1.1 Heater Configuration Example
        2. 7.4.1.2 Heater Electrical Behavior
        3. 7.4.1.3 Heater Temperature Increase
        4. 7.4.1.4 Heater Usage Guidelines
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Rehydration Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
    6. 8.6 Storage and PCB Assembly
      1. 8.6.1 Storage and Handling
      2. 8.6.2 Product Storage
      3. 8.6.3 PCB Assembly Flow
      4. 8.6.4 Rework Consideration
      5. 8.6.5 Sensitivity to Chemicals and Vapors
      6. 8.6.6 Exposure to High Temperature and High Humidity Conditions
      7. 8.6.7 Recovering Sensor Performance: Bake and Rehydration Procedure
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DEF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1.3 Heater Temperature Increase

The heater induced temperature increase has high dependency on the power supply VDD. Figure 7-13 illustrates the typical temperature increase profile at different power supply level. The data is captured on a 15mm × 15mm, 1.575mm FR4 PCB.

HDC3120 Heater Induced Temperature Increase vs Supply Voltage on a Rigid 1.575mm FR4 PCB Figure 7-13 Heater Induced Temperature Increase vs Supply Voltage on a Rigid 1.575mm FR4 PCB

Figure 7-14 illustrates a temperature rise measurement example with the device mounted on a single-layer 1.575mm FR4 PCB, and the thermal pad left unsoldered. Depending on the power supply used, the sensor die is able to reach different temperatures.

HDC3120 Heater Induced Temperature Increase on a Rigid PCB (1.575mm FR4) Figure 7-14 Heater Induced Temperature Increase on a Rigid PCB (1.575mm FR4)

To achieve higher heater temperatures, mount the device on a thin Flex PCB, which minimizes the impact of large PCB thermal mass. Figure 7-15 illustrates a temperature rise measurement example with the device mounted on a single-layer 0.13mm Flex PCB, and the thermal pad left unsoldered. With a high supply voltage of 5V applied to the device, the sensor die is able to reach approximately 100°C in ambient conditions.

HDC3120 Heater Induced Temperature Increase on a FlexPCB (0.13mm Flex) Figure 7-15 Heater Induced Temperature Increase on a FlexPCB (0.13mm Flex)