SLLSFJ6G December   2019  – February 2023 ISO6740 , ISO6741 , ISO6742

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description Continued
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Supply
    10. 7.10 Supply Current Characteristics—5-V Supply
    11. 7.11 Electrical Characteristics—3.3-V Supply
    12. 7.12 Supply Current Characteristics—3.3-V Supply
    13. 7.13 Electrical Characteristics—2.5-V Supply 
    14. 7.14 Supply Current Characteristics—2.5-V Supply
    15. 7.15 Electrical Characteristics—1.8-V Supply
    16. 7.16 Supply Current Characteristics—1.8-V Supply
    17. 7.17 Switching Characteristics—5-V Supply
    18. 7.18 Switching Characteristics—3.3-V Supply
    19. 7.19 Switching Characteristics—2.5-V Supply
    20. 7.20 Switching Characteristics—1.8-V Supply
    21. 7.21 Insulation Characteristics Curves
    22. 7.22 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
    2. 14.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

6 Pin Configuration and Functions

GUID-20210126-CA0I-KJKB-XBZ8-0BJBPZSXBMCM-low.gifFigure 6-1 ISO6740 DW Package16-Pin SOIC-WB Top View
GUID-20200729-CA0I-NNVS-2HBJ-NM3VMKVKWDLK-low.gifFigure 6-2 ISO6741 DW Package16-Pin SOIC-WBTop View
GUID-20210126-CA0I-SGMD-HJJB-7CFZ95JL2VND-low.gifFigure 6-3 ISO6742 DW Package16-Pin SOIC-WB Top View
Table 6-1 Pin Functions
PINI/ODESCRIPTION
NAMEISO6740ISO6741ISO6742
EN1-77IOutput enable 1. Output pins on side 1 are enabled when EN1 is high or open and in high-impedance state when EN1 is low.
EN2101010IOutput enable 2. Output pins on side 2 are enabled when EN2 is high or open and in high-impedance state when EN2 is low.
GND12, 82,82,8—Ground connection for VCC1
GND29, 159,159,15—Ground connection for VCC2
INA333IInput, channel A
INB444IInput, channel B
INC5512IInput, channel C
IND61111IInput, channel D
NC7--Not connected
OUTA141414OOutput, channel A
OUTB131313OOutput, channel B
OUTC12125OOutput, channel C
OUTD1166OOutput, channel D
VCC1111—Power supply, side 1
VCC2161616—Power supply, side 2