SLLSF86C May   2018  – March 2022 ISOW1412 , ISOW1432

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description Continued
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  Recommended Operating Conditions
    3. 8.3  Thermal Information
    4. 8.4  Power Ratings
    5. 8.5  Insulation Specifications
    6. 8.6  Safety-Related Certifications
    7. 8.7  Safety Limiting Values
    8. 8.8  Electrical Characteristics
    9. 8.9  Supply Current Characteristics at VISOOUT = 3.3 V
    10. 8.10 Supply Current Characteristics at  VISOOUT = 5 V
    11. 8.11 Switching Characteristics at VISOOUT = 3.3 V
    12. 8.12 Switching Characteristics at VISOOUT = 5 V
    13. 8.13 Insulation Characteristics Curves
    14. 8.14 Typical Characteristics
  9. Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Power Isolation
    3. 10.3 Signal Isolation
    4. 10.4 RS-485
    5. 10.5 Functional Block Diagram
    6. 10.6 Feature Description
      1. 10.6.1 Power-Up and Power-Down Behavior
      2. 10.6.2 Protection Features
      3. 10.6.3 Failsafe Receiver
      4. 10.6.4 Glitch-Free Power Up and Power Down
    7. 10.7 Device Functional Modes
    8. 10.8 Device I/O Schematics
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Data Rate, Bus Length and Bus Loading
        2. 11.2.2.2 Stub Length
        3. 11.2.2.3 Insulation Lifetime
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Receiving Notification of Documentation Updates
    3. 14.3 Support Resources
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • DFM|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Meets or exceeds the requirements of the TIA/ EIA-485A standard
  • Data rates
    • ISOW1412 : 500 kbps
    • ISOW1432 : 12 Mbps
  • Integrated low-emissions DC-DC converter with low-emissions, low-noise
    • Meets CISPR 32 Class B and EN 55032 Class B with margin on a two-layer PCB
    • Low frequency power converter at 25 MHz enabling low noise performance
  • Additional 2 Mbps GPIO channel
  • High efficiency output power
    • Typical efficiency: 46%
    • VISOOUT accuracy: ±5%
    • Additional output current: 20 mA
  • Independent power supply for RS-485 & DC-DC
    • Logic supply (VIO): 1.71 V to 5.5 V
    • Power converter supply ( VDD): 3 V to 5.5 V
  • RS-485 with PROFIBUS compatibility
    • Open, short, and idle bus failsafe
    • 1/8 unit load: up to 256 nodes on bus
    • Glitch-free power up and power down
  • Reinforced and Basic isolation options
  • High CMTI: 100-kV/µs (typical)
  • High ESD bus protection
    • HBM: ±16 kV
    • IEC 61000-4-2 contact discharge: ±8 kV
  • Operating temperature range: -40°C to 125°C
  • Current limit and thermal shutdown
  • 20-pin wide SOIC package
  • Section 8.6:
    • VDE reinforced and basic insulation per DIN VDE V 0884-11:2017-01
    • UL 1577 component recognition program
    • IEC 62368-1, IEC 61010-1, IEC 60601-1 and GB 4943.1-2011 certifications