SWRS283A June   2022  – November 2022 IWR6243

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Power-On Hours (POH)
    4. 8.4 Recommended Operating Conditions
    5. 8.5 Power Supply Specifications
    6. 8.6 Power Consumption Summary
    7. 8.7 RF Specification
    8. 8.8 Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    9. 8.9 Timing and Switching Characteristics
      1. 8.9.1 Power Supply Sequencing and Reset Timing
      2. 8.9.2 Synchronized Frame Triggering
      3. 8.9.3 Input Clocks and Oscillators
        1. 8.9.3.1 Clock Specifications
      4. 8.9.4 Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 8.9.4.1 Peripheral Description
          1. 8.9.4.1.1 SPI Timing Conditions
          2. 8.9.4.1.2 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
          3. 8.9.4.1.3 SPI Peripheral Mode Timing Requirements (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        2. 8.9.4.2 Typical Interface Protocol Diagram (Peripheral Mode)
      5. 8.9.5 Inter-Integrated Circuit Interface (I2C)
        1. 8.9.5.1 I2C Timing Requirements
      6. 8.9.6 LVDS Interface Configuration
        1. 8.9.6.1 LVDS Interface Timings
      7. 8.9.7 General-Purpose Input/Output
        1. 8.9.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 8.9.8 Camera Serial Interface (CSI2)
        1. 8.9.8.1 CSI2 Switching Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Subsystems
      1. 9.3.1 RF and Analog Subsystem
        1. 9.3.1.1 Clock Subsystem
        2. 9.3.1.2 Transmit Subsystem
        3. 9.3.1.3 Receive Subsystem
      2. 9.3.2 Host Interface
    4. 9.4 Other Subsystems
      1. 9.4.1 ADC Data Format Over CSI2 Interface
      2. 9.4.2 ADC Channels (Service) for User Application
        1. 9.4.2.1 GPADC Parameters
  10. 10Monitoring and Diagnostic Mechanisms
  11. 11Applications, Implementation, and Layout
    1. 11.1 Application Information
    2. 11.2 Radar Sensor for Industrial Applications
    3. 11.3 Imaging Radar using Cascade Configuration
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Documentation Support
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Export Control Notice
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information
    2.     Package Option Addendum
    3. 13.2 Tape and Reel Information
    4.     Tray Information
    5.     Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABL|161
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.9.3.1 Clock Specifications

An external crystal is connected to the device pins. #FIG_D1E247917 shows the crystal implementation.

GUID-B13B09EB-89DD-405F-B5D2-BF03D5A6C86E-low.gifFigure 8-4 Crystal Implementation
Note:

The load capacitors, Cf1 and Cf2 in #FIG_D1E247917, should be chosen such that #T4362547-51 is satisfied. CL in the equation is the load specified by the crystal manufacturer. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator CLKP and CLKM pins.Note that Cf1 and Cf2 include the parasitic capacitances due to PCB routing.

Equation 1. GUID-F76D759A-6D15-4C6E-88E2-67E0ACFF1540-low.gif

Table 8-6 lists the electrical characteristics of the clock crystal.

Table 8-6 Crystal Electrical Characteristics (Oscillator Mode)
NAMEDESCRIPTIONMINTYPMAXUNIT
fPParallel resonance crystal frequency40MHz
CLCrystal load capacitance5812pF
ESRCrystal ESR50Ω
Temperature rangeExpected temperature range of operation–40125°C
Frequency toleranceCrystal frequency tolerance#T4362547-60#T4362547-61-200200ppm
Drive level50200µW
(1) The crystal manufacturer's specification must satisfy this requirement.
(2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance.

In the case where an external clock is used as the clock resource, the signal is fed to the CLKP pin only; CLKM is grounded. The phase noise requirement is very important when a 40-MHz clock is fed externally. Table 8-7 lists the electrical characteristics of the external clock signal.

Table 8-7 External Clock Mode Specifications
PARAMETERSPECIFICATIONUNIT
MINTYPMAX
Input Clock:
External AC-coupled sine wave or DC-coupled square wave
Phase Noise referred to 40 MHz		Frequency40MHz
AC-Amplitude7001200mV (pp)
DC-trise/fall10ns
Phase Noise at 1 kHz–132dBc/Hz
Phase Noise at 10 kHz–143dBc/Hz
Phase Noise at 100 kHz–152dBc/Hz
Phase Noise at 1 MHz–153dBc/Hz
Duty Cycle3565%
Freq Tolerance–5050ppm
Input clock requirements for Secondary device in cascade mode (assuming the 20Ghz clock is provided from the Primary device in cascade) Phase Noise at 10 kHz -127 dBc/Hz
Phase Noise at 100 kHz -137 dBc/Hz
Phase Noise at 1 MHz -147 dBc/Hz
Period jitter @40Mhz 1.75 ps rms
Spur levels (sum of all spurs) -52 dBc