SNOS412Q February   2000  – January 2023 LM1117

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 LM1117 Electrical Characteristics
    6. 7.6 LM1117I Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Load Regulation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Protection Diodes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 External Capacitors
          1. 9.2.2.1.1 Input Bypass Capacitor
          2. 9.2.2.1.2 Adjust Terminal Bypass Capacitor
          3. 9.2.2.1.3 Output Capacitor
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Heat Sink Requirements
      2. 9.5.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MINMAXUNIT
Input voltage (VIN to GND)15V
Junction temperature (TJ)(1)LM11170125°C
LM1117I−40125
(1) The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.