SNVS625G February   2011  – March 2022 LM21215

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Precision Enable
      2. 7.3.2 UVLO
      3. 7.3.3 Current Limit
      4. 7.3.4 Short-Circuit Protection
      5. 7.3.5 Thermal Protection
      6. 7.3.6 Light Load Operation
      7. 7.3.7 Power Good Flag
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Output Voltage
          3. 8.2.1.2.3 Precision Enable
          4. 8.2.1.2.4 Soft Start
          5. 8.2.1.2.5 Inductor Selection
          6. 8.2.1.2.6 Output Capacitor Selection
          7. 8.2.1.2.7 Input Capacitor Selection
          8. 8.2.1.2.8 Programmable Current Limit
          9. 8.2.1.2.9 Control Loop Compensation
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application Schematic 2
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. 9 Layout
    1. 9.1 Layout Considerations
    2. 9.2 Layout Example
      1. 9.2.1 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-41933B58-C317-4728-AF77-956EBD9FEED3-low.gif Figure 5-1 20-Pin HTSSOP PackagePWP Package(Top View)
Table 5-1 Pin Functions
PIN
NO. NAME DESCRIPTION
1 ILIM Resistor-programmable current limit pin. A resistor connected to this pin and ground sets the value of the rising current limit, ICLR. Shorting this pin to AGND programs the device to the maximum possible current limit.
2 SS/TRK Soft-start control pin. An internal 2-µA current source charges an external capacitor connected between this pin and AGND to set the output voltage ramp rate during start-up. This pin can also be used to configure the tracking feature.
3 EN Active high enable input for the device. If not used, the EN pin can be left open, which goes high due to an internal current source.
4 AVIN Analog input voltage supply that generates the internal bias. It is recommended to connect PVIN to AVIN through a low pass RC filter to minimize the influence of input rail ripple and noise on the analog control circuitry.
5,6,7 PVIN Input voltage to the power switches inside the device. These pins should be connected together at the device. A low-ESR input capacitance should be located as close as possible to these pins.
8,9,10 PGND Power ground pins for the internal power switches
11-16 SW Switch node pins. These pins should be tied together locally and connected to the filter inductor.
17 PGOOD Open-drain power good indicator
18 COMP Compensation pin is connected to the output of the voltage loop error amplifier
19 FB Feedback pin is connected to the inverting input of the voltage loop error amplifier
20 AGND Quiet analog ground for the internal reference and bias circuitry
EP Exposed Pad Exposed metal pad on the underside of the package with an electrical and thermal connection to PGND. TI recommends connecting this pad to the PC board ground plane in order to improve thermal dissipation.