SNVS397F September   2005  – December 2025 LM5005

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High-Voltage Start-Up Regulator
      2. 6.3.2 Shutdown and Standby
      3. 6.3.3 Oscillator and Synchronization Capability
      4. 6.3.4 Error Amplifier and PWM Comparator
      5. 6.3.5 RAMP Generator
      6. 6.3.6 Current Limit
      7. 6.3.7 Soft-Start Capability
      8. 6.3.8 MOSFET Gate Driver
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Standby Mode
      3. 6.4.3 Light-Load Operation
      4. 6.4.4 Thermal Shutdown Protection
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Reducing Bias Power Dissipation
      2. 7.1.2 Input Voltage UVLO Protection
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Custom Design With WEBENCH® Tools
        2. 7.2.2.2  Frequency Set Resistor (RT)
        3. 7.2.2.3  Inductor (LF)
        4. 7.2.2.4  Ramp Capacitor (CRAMP)
        5. 7.2.2.5  Output Capacitors (COUT)
        6. 7.2.2.6  Schottky Diode (DF)
        7. 7.2.2.7  Input Capacitors (CIN)
        8. 7.2.2.8  VCC Capacitor (CVCC)
        9. 7.2.2.9  Bootstrap Capacitor (CBST)
        10. 7.2.2.10 Soft Start Capacitor (CSS)
        11. 7.2.2.11 Feedback Resistors (RFB1 and RFB2)
        12. 7.2.2.12 RC Snubber (RS and CS)
        13. 7.2.2.13 Compensation Components (RC1, CC1, CC2)
        14. 7.2.2.14 Bill of Materials
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Layout for EMI Reduction
        2. 7.4.1.2 Thermal Design
        3. 7.4.1.3 Ground Plane Design
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Device Support
      1. 8.2.1 Development Support
        1. 8.2.1.1 Custom Design With WEBENCH® Tools
    3. 8.3 Documentation Support
      1. 8.3.1 Related Documentation
        1. 8.3.1.1 PCB Layout Resources
        2. 8.3.1.2 Thermal Design Resources
    4. 8.4 Receiving Notification of Documentation Updates
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision E (November 2016) to Revision F (December 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed legacy terminology throughout document from: master to: controller and from: slave to: peripheralGo
  • Updated VCC Current limit from: 20mA to: 25mAGo
  • Updated VCC UVLO threshold from: 6.35V to: 5.35VGo
  • Updated VCC Undervoltage Hysteresis from: 1V to: 0.25VGo
  • Added typical Bias current, IIN current informationGo
  • Updated bias current IIN maximum current from: 5mA to: 4.5mAGo
  • Updated typical shutdown current from: 60μA to: 48μAGo
  • Updated maximum shutdown current from: 100μA to: 85μAGo
  • Added Pre-charge Switch on time parameterGo
  • Updated Buck Switch Rds_on from: 160mΩ to: 170mΩGo
  • Updated BOOST UVLO Hysteresis from: 0.56V to: 0.8VGo
  • Updated cycle by cycle current limit delay from: 100nsec to: 75nsecGo

Changes from Revision D (March 2013) to Revision E (November 2016)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Simplified Application Schematic imageGo
  • Added Typical Application Circuit imageGo
  • Changed Junction to Ambient, RθJA, value in the Thermal Information table From: 40 To: 35.2Go
  • Changed Junction to Case, RθJC(bot), value in the Thermal Information table From: 4 To: 1.2Go
  • Changed Efficiency vs IOUT and VIN graphGo
  • Deleted RRAMP to VCC for VOUT > 7.5V figureGo
  • Added Connection of External Ramp Resistor to VCC when VOUT > 7.5V figureGo