SNVSBW1B December   2021  – October 2023 LM63460-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1. 6.1 Wettable Flanks
    2. 6.2 Pinout Design for Clearance and FMEA
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Systems Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range (VIN1, VIN2)
      2. 8.3.2  Output Voltage Setpoint (FB)
      3. 8.3.3  Precision Enable and Input Voltage UVLO (EN/SYNC)
      4. 8.3.4  Frequency Synchronization (EN/SYNC)
      5. 8.3.5  Clock Locking
      6. 8.3.6  Adjustable Switching Frequency (RT)
      7. 8.3.7  Power-Good Monitor (PGOOD)
      8. 8.3.8  Bias Supply Regulator (VCC, BIAS)
      9. 8.3.9  Bootstrap Voltage and UVLO (CBOOT)
      10. 8.3.10 Spread Spectrum
      11. 8.3.11 Soft Start and Recovery From Dropout
      12. 8.3.12 Overcurrent and Short-Circuit Protection
      13. 8.3.13 Thermal Shutdown
      14. 8.3.14 Input Supply Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
        1. 8.4.3.1 CCM Mode
        2. 8.4.3.2 AUTO Mode – Light-Load Operation
          1. 8.4.3.2.1 Diode Emulation
          2. 8.4.3.2.2 Frequency Foldback
        3. 8.4.3.3 FPWM Mode – Light-Load Operation
        4. 8.4.3.4 Minimum On-Time (High Input Voltage) Operation
        5. 8.4.3.5 Dropout
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 – Automotive Synchronous Buck Regulator at 2.1 MHz
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2  Setting the Output Voltage
          3. 9.2.1.2.3  Choosing the Switching Frequency
          4. 9.2.1.2.4  Inductor Selection
          5. 9.2.1.2.5  Output Capacitor Selection
          6. 9.2.1.2.6  Input Capacitor Selection
          7. 9.2.1.2.7  Bootstrap Capacitor
          8. 9.2.1.2.8  VCC Capacitor
          9. 9.2.1.2.9  BIAS Power Connection
          10. 9.2.1.2.10 Feedforward Network
          11. 9.2.1.2.11 Input Voltage UVLO
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2 – Automotive Synchronous Buck Regulator at 400 kHz
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Thermal Design and Layout
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

The value of RθJA given in this table is only valid for comparison with other packages and cannot be used for design purposes. These values were calculated in accordance with JESD 51-7 and simulated on a 4-layer JEDEC board. They do not represent the performance obtained in an actual application. For example, the EVM for this device achieves an RθJA of 23.5℃/W. 
THERMAL METRIC(1) LM63460-Q1 UNIT
RYF (VQFN)
22 PINS
RθJA Junction-to-ambient thermal resistance (LM63460-Q1 EVM)(3) 23.5 °C/W
RθJA Junction-to-ambient thermal resistance (JESD 51-7)(2) 38.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 30.3 °C/W
RθJB Junction-to-board thermal resistance 8.8 °C/W
ΨJT Junction-to-top characterization parameter 1 °C/W
ΨJB Junction-to-board characterization parameter 8.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 8.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The value of RθJA given in this table is only valid for comparison with other packages and cannot be used for design purposes. These values were calculated in accordance with JESD 51-7 and simulated on a 4-layer JEDEC board. They do not represent the performance obtained in an actual application.
(3) Refer to the LM63460-Q1 EVM User's Guide for board layout and additional information. For thermal design information please see the Application Information section.