SLUSFB7C September   2023  – September 2025 LMG3624

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 GaN Power FET Switching Parameters
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 GaN Power FET Switching Capability
      2. 7.3.2 Turn-On Slew-Rate Control
      3. 7.3.3 Current-Sense Emulation
      4. 7.3.4 Input Control Pins (EN, IN)
      5. 7.3.5 AUX Supply Pin
        1. 7.3.5.1 AUX Power-On Reset
        2. 7.3.5.2 AUX Under-Voltage Lockout (UVLO)
      6. 7.3.6 Overcurrent Protection
      7. 7.3.7 Overtemperature Protection
      8. 7.3.8 Fault Reporting
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Turn-On Slew-Rate Design
        2. 8.2.2.2 Current-Sense Design
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Solder-Joint Stress Relief
        2. 8.4.1.2 Signal-Ground Connection
        3. 8.4.1.3 CS Pin Signal
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • REQ|38
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision B (April 2025) to Revision C (September 2025)

  • Added LMG3624Y information throughoutGo
  • Updated with LMG3624Y data and separated LMG3624 dataGo
  • Added LMG3624Y to Slew-Rate SettingsGo

Changes from Revision A (June 2024) to Revision B (April 2025)

  • Updated voltage rating from 650V to 700V and drain-source on resistance from 170mΩ to 155mΩ Go
  • Updated text in the Applications sectionGo
  • Updated voltage rating with Footnote (2), and added Footnote (3) in Absolute Maximum Ratings sectionGo
  • Added max value of drain-source on resistance at 25℃ and Updated typical value of drain-source on resistance at both 25℃ and 125℃ in the GAN POWER FET sub-section of Electrical Characteristics sectionGo
  • Added min value of temperature fault – postive-going threshold temperature in the OVERTEMPERATURE PROTECTION sub-section of Electrical Characteristics sectionGo
  • Added Output Capacitance vs Drain-Source Voltage graph and Output Capacitance Stored Energy vs Drain-Source Voltage graphs in Typical Characteristics sectionGo
  • Updated figure and added sentence clarifying application usage in GaN Power FET Switching Capability sectionGo
  • Updated figure in Layout Example the sectionGo