SNAS771A December 2018 – December 2018 LMK05318
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
The LMK05318 is a high-performance device. To ensure good electrical and thermal performance, TI recommends to design a thermally-enhanced interface between the IC ground/thermal pad and the PCB ground using at least a 5×5 through-hole via pattern connected to multiple PCB ground layers as shown in Figure 68.