SNWS014D March   2004  – June 2025 LMV242 , LMV2421

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Electrical Characteristics for 2.6V
    4. 5.4 Electrical Characteristics for 5V
    5. 5.5 Timing Diagram
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power-Control Principles
      2. 7.1.2 Power Amplifier Controlled Loop
        1. 7.1.2.1 General Overview
        2. 7.1.2.2 Typical PA Closed Loop Control Setup
          1. 7.1.2.2.1 Power Control Over Wide Dynamic Range
      3. 7.1.3 Attenuation Between the Coupler and LMV242x Detector
      4. 7.1.4 Control of the LMV242x
        1. 7.1.4.1 VRAMP Signal
        2. 7.1.4.2 Transmit Enable
        3. 7.1.4.3 Band Select (LMV242 Only)
        4. 7.1.4.4 Analog Output
      5. 7.1.5 Frequency Compensation
    2. 7.2 Typical Application
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NGY|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
VALUE
Supply voltage  VDD – GND 6.5V max
ESD tolerance (2)    Human body model 2kV
Machine model 200V
Storage temperature −65°C to +150°C
Junction temperature (3) 150°C max
Mounting temperature Infrared or convection (20s) 235°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device can occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see the Section 5.3.
(2) Human body model: 1.5kΩ in series with 100pF.
(3) The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA) / θJA. All numbers apply for packages soldered directly into a printed circuit board (PCB).