SBOSA11E March   2020  – December 2023 OPA206 , OPA2206 , OPA4206

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: OPA206
    5. 5.5 Thermal Information: OPA2206
    6. 5.6 Thermal Information: OPA4206
    7. 5.7 Electrical Characteristics: VS = ±5 V
    8. 5.8 Electrical Characteristics: VS = ±15 V
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Typical Specifications and Distributions
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Overvoltage Protection
      2. 7.3.2 Input Offset Trimming
      3. 7.3.3 Lower Input Bias With Super-Beta Inputs
      4. 7.3.4 Overload Power Limiter
      5. 7.3.5 EMI Rejection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Voltage Attenuator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Discrete, Two-Op-Amp Instrumentation Amplifier
      3. 8.2.3 Input Buffer and Protection for ADC Driver
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.