SBOSA11A March   2020  – March 2021 OPA2206

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA2206
    5. 6.5 Electrical Characteristics: VS = ±5 V
    6. 6.6 Electrical Characteristics: VS = ±15 V
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Typical Specifications and Distributions
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Overvoltage Protection
      2. 8.3.2 Input Offset Trimming
      3. 8.3.3 Lower Input Bias With Super-Beta Inputs
      4. 8.3.4 Overload Power Limiter
      5. 8.3.5 EMI Rejection
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Voltage Attenuator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Discrete, Two-Op-Amp Instrumentation Amplifier
      3. 9.2.3 Input Buffer and Protection for ADC Driver
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Input Offset Trimming

The OPA2206 is the industry's first e-trim operational amplifier built on a bipolar process. The input offset voltage of an amplifier is determined by the inherent mismatch between the input transistors. The offset can be minimized using laser-trimming performed during the manufacturing process while the device is still in the bare silicon form. However, when the silicon is packaged, the packaging process introduces additional offset due to mechanic stresses. TI's new trimming processes are used to trim the offset after the packaging process is complete to minimize both inherent and package-induced offsets. After trimming, communication is disabled to make sure the amplifier operates properly in the final system.

A comparison between production offset values for a the industry popular, laser-trimmed OPA2277 amplifier and the OPA2206 proprietary trim can be seen in Figure 8-3 and Figure 8-4.

GUID-2D224AF4-6C85-4FA6-83CE-D3FA887A69C5-low.gifFigure 8-3 OPA2277 Laser-Trimmed Operational Amplifier Offset
GUID-20210323-CA0I-90KD-FQ3F-FXR1QVPW6MWB-low.pngFigure 8-4 OPA2206 e-trim™ Operational Amplifier Offset

The OPA2206 is also trimmed at two temperatures to minimize the input offset voltage drift over temperature. The final performance of the offset drift can be seen in Figure 8-5.


GUID-20210322-CA0I-MQNP-KXC8-4ZRDPRNVSP9J-low.pngFigure 8-5 OPA2206 e-trim™ Operational Amplifier Drift