SBOSA11A March   2020  – March 2021 OPA2206

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA2206
    5. 6.5 Electrical Characteristics: VS = ±5 V
    6. 6.6 Electrical Characteristics: VS = ±15 V
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Typical Specifications and Distributions
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Overvoltage Protection
      2. 8.3.2 Input Offset Trimming
      3. 8.3.3 Lower Input Bias With Super-Beta Inputs
      4. 8.3.4 Overload Power Limiter
      5. 8.3.5 EMI Rejection
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Voltage Attenuator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Discrete, Two-Op-Amp Instrumentation Amplifier
      3. 9.2.3 Input Buffer and Protection for ADC Driver
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information: OPA2206

THERMAL METRIC(1) OPA2206 UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 175.6 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 63.1 ℃/W
RθJB Junction-to-board thermal resistance 97.2 ℃/W
ψJT Junction-to-top characterization parameter 7.8 ℃/W
ψJB Junction-to-board characterization parameter 95.5 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A ℃/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.