SBOSAA5B April   2022  – September 2022 OPA2675

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Family Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Full Bias and Offline Mode VS = ±6 V
    6. 7.6  Electrical Characteristics: 75% Bias Mode VS = ±6 V
    7. 7.7  Electrical Characteristics: 50% Bias Mode VS = ±6 V
    8. 7.8  Electrical Characteristics: DIfferential Output  VS = 12 V
    9. 7.9  Electrical Characteristics: VS = 5 V
    10. 7.10 Typical Characteristics: VS = ±6 V, Full Bias
    11. 7.11 Typical Characteristics: VS = ±6 V Differential, Full Bias
    12. 7.12 Typical Characteristics: VS = ±6 V, 75% Bias
    13. 7.13 Typical Characteristics: VS = ±6 V, 50% Bias
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Suggestions
        1. 8.3.1.1 Setting Resistor Values to Optimize Bandwidth
        2. 8.3.1.2 Output Current and Voltage
        3. 8.3.1.3 Driving Capacitive Loads
        4. 8.3.1.4 Line Driver Headroom Model
        5. 8.3.1.5 Noise Performance
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 High-Speed Active Filters
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Thermal Analysis
    2. 10.2 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

GUID-0253FE34-38D4-4685-AEF2-AD5F9668FDB4-low.gifFigure 6-1 RGV Package,
16-Pin VQFN
(Top View)
Figure 6-2 RGV Package,
16-Pin VQFN
(Bottom View)
Table 6-1 Pin Functions
PIN TYPE(2) DESCRIPTION
NAME NO.
A0 8 I Bias Mode Control
A1 9 I Bias Mode Control
GND 4 P Ground
–IN A 2 I Amplifier A inverting input
+IN A 3 I Amplifier A noninverting input
–IN B 11 I Amplifier B inverting input
+IN B 10 I Amplifier B noninverting input
NC(1) 1, 5, 6, 12, 15 Do not connect.
OUT A 16 O Amplifier A output
OUT B 13 O Amplifier B output
–VS 7 P Negative power-supply connection
+VS 14 P Positive power-supply connection
Thermal Pad Electrically connected to die substrate and VS–. Connect to VS– on the PCB for best performance.
There is no internal connection. Typically GND is the recommended connection to a heat spreading plane.
I = input, O = output, P = power, GND = ground, NC = no connect.