SBOSAC8 December   2024 OPT4041

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Timing Requirements
    7. 5.7 I2C Timing Diagram
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Spectral Response
        1. 6.3.1.1 Channel 0: Human Eye Matching
        2. 6.3.1.2 Channel 1: Wide Band
      2. 6.3.2 Automatic Full-Scale Range Setting
      3. 6.3.3 Output Register CRC and Counter
        1. 6.3.3.1 Output Sample Counter
        2. 6.3.3.2 Output CRC
      4. 6.3.4 Threshold Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
      2. 6.4.2 Interrupt Modes of Operation
      3. 6.4.3 Light Range Selection
      4. 6.4.4 Selecting Conversion Time
      5. 6.4.5 Light Measurement in Lux
      6. 6.4.6 Threshold Detection Calculations
      7. 6.4.7 Light Resolution
    5. 6.5 Programming
      1. 6.5.1 I2C Bus Overview
        1. 6.5.1.1 Serial Bus Address
        2. 6.5.1.2 Serial Interface
      2. 6.5.2 Writing and Reading
        1. 6.5.2.1 High-Speed I2C Mode
        2. 6.5.2.2 Burst Read Mode
        3. 6.5.2.3 General-Call Reset Command
  8. Register Maps
    1. 7.1 Register Descriptions
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Electrical Interface
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Optical Interface
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Optomechanical Design
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
        1. 8.5.2.1 Soldering and Handling Recommendations
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data
    2. 11.2 Package Option Addendum
    3. 11.3 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

All specifications at TA = 25°C, VDD = 3.3V, 800ms conversion-time (CONVERSION_TIME=0xB), automatic full-scale range, white LED and normal-angle incidence of light, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OPTICAL
Number of channels 2
Peak irradiance spectral responsivity CH0 (ALS) 561 nm
CH1 (WB) 518 nm
ADC resolution 9 20 bits
Range determination CH0 (ALS) 4 bits
CH1 (WB) 3 bits
Tconv Light Conversion-time per channel(4) Conversion-time CT = 0x6 25 ms
Conversion-time CT = 0xB 800 ms
EvLSB Equivalent resolution CH0 (ALS) Lowest auto gain range, 800ms conversion-time per channel 585 µlux
Lowest auto gain range, 100ms conversion-time per channel 4.68 mlux
Equivalent resolution CH1 (IR) Lowest auto gain range, 800ms conversion-time per channel, 520nm stimulus 0.1923 nW/cm2
Lowest auto gain range, 100ms conversion-time per channel, 520nm stimulus 1.538 nW/cm2
Peak responsitivity CH0 (ALS) Lowest auto gain range, 800ms conversion per channel 11400 codes per μW/cm2
CH1 (WB) Lowest auto gain range, 800ms conversion per channel 5200 codes per μW/cm2
EvFS Full-scale Illuminance CH0 (ALS) 157035 lux
CH1 (WB) 12.91 mW/cm2
Ev Measurement output result for ALS Channel (CH0) 2000 lux input(1) 1800 2000 2200 lux
Relative accuracy between gain ranges (2) All channels 0.6 %
EvIR Infrared response 850-nm near infrared, CH0 (ALS) response 0.2 %
Light source variation for lux measurement (incandescent, halogen, fluorescent) Bare device, no cover glass 4 %
Linearity EXPONENT_CHx > 0, 100ms conversion-time CT=8, all channels 2 %
EXPONENT_CHx = 0, 100ms conversion-time CT=8, all channels 5 %
Drift across temperature All channels 0.01 %/°C
Dark Measurement All channels 0 10 codes
Angular response (FWHM) CH0 (ALS) 121 °
CH1 (WB) 128 °
PSRR Power-supply rejection ratio(3) VDD at 3.6V and 1.6V, all channels 0.1 %/V
POWER SUPPLY
VDD Power supply 1.6 3.6 V
VI2C Power supply for I2C pull up resistor I2C pullup resistor, VDDVI2C 1.6 5.5 V
IQACTIVE Active Current Dark 24 µA
Full-scale lux 29 µA
IQ Quiescent current Dark 2 µA
Full-scale lux 2.6 µA
POR Power-on-reset threshold 0.8 V
DIGITAL
CIO I/O Pin Capacitance 3 pF
Tss Trigger to Sample Start Low-power shutdown mode 0.5 ms
VIL Low-level input voltage (SDA, SCL, and ADDR) 0 0.3 X VDD V
VIH High-level input voltage (SDA, SCL, and ADDR) 0.7 X VDD 5.5 V
IIL Low-level input current (SDA, SCL, and ADDR) 0.01 0.25(5) µA
VOL Low-level output voltage (SDA and INT) IOL=3mA 0.32 V
IZH Output logic high, high-Z leakage current (SDA, INT) Measured with VDD at pin 0.01 0.25(5) µA
TEMPERATURE
Specified temperature range –40 85 °C
Tested with the white LED calibrated to 2000lux
Characterized by measuring fixed near-full-scale light levels on the higher adjacent full-scale range setting.
PSRR is the percent change of the measured lux output from its current value, divided by the change in power supply voltage, as characterized by results from 3.6V and 1.6V power supplies
The conversion-time, from start of conversion until the data are ready to be read, is the integration-time plus analog-to-digital conversion-time.
The specified leakage current is dominated by the production test equipment limitations. Typical values are much smaller