SBOSAC8 December   2024 OPT4041

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Timing Requirements
    7. 5.7 I2C Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Spectral Response
        1. 6.3.1.1 Channel 0: Human Eye Matching
        2. 6.3.1.2 Channel 1: Wide Band
      2. 6.3.2 Automatic Full-Scale Range Setting
      3. 6.3.3 Output Register CRC and Counter
        1. 6.3.3.1 Output Sample Counter
        2. 6.3.3.2 Output CRC
      4. 6.3.4 Threshold Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
      2. 6.4.2 Interrupt Modes of Operation
      3. 6.4.3 Light Range Selection
      4. 6.4.4 Selecting Conversion Time
      5. 6.4.5 Light Measurement in Lux
      6. 6.4.6 Threshold Detection Calculations
      7. 6.4.7 Light Resolution
    5. 6.5 Programming
      1. 6.5.1 I2C Bus Overview
        1. 6.5.1.1 Serial Bus Address
        2. 6.5.1.2 Serial Interface
      2. 6.5.2 Writing and Reading
        1. 6.5.2.1 High-Speed I2C Mode
        2. 6.5.2.2 Burst Read Mode
        3. 6.5.2.3 General-Call Reset Command
  8. 7 Register Maps
    1. 7.1 Register Descriptions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Electrical Interface
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Optical Interface
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Optomechanical Design
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
        1. 8.5.2.1 Soldering and Handling Recommendations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data
    2. 11.2 Package Option Addendum
    3. 11.3 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 I2C Interface Timing Requirements

All timing parameters are referenced to low and high voltage thresholds of 30% and 70%, respectively, of the final settled value.
MIN TYP MAX UNIT
I2C FAST MODE
fSCL Clock operating frequency 0.01 0.4 MHz
tBUF Bus free time between stop and start 1300 ns
tHDSTA Hold time after repeated start 600 ns
tSUSTA Setup time for repeated start 600 ns
tSUSTO Setup time for stop 600 ns
tHDDAT Data hold time 20 900 ns
tSUDAT Data setup time 100 ns
tLOW Clock low period 1300 ns
tHIGH Clock high period 600 ns
tRC and tFC Clock rise and fall time 300 ns
tRD and tFD Data rise and fall time 300 ns
tTIMEO Bus timeout period. If the clock line is held low for this duration of time, the bus state machine is reset. 28 ms
I2C HIGH-SPEED MODE
fSCL Clock operating frequency 0.01 2.6 MHz
tBUF Bus free time between stop and start 160 ns
tHDSTA Hold time after repeated start 160 ns
tSUSTA Setup time for repeated start 160 ns
tSUSTO Setup time for stop 160 ns
tHDDAT Data hold time 20 140 ns
tSUDAT Data setup time 20 ns
tLOW Clock low period 240 ns
tHIGH Clock high period 60 ns
tRC and tFC Clock rise and fall time 40 ns
tRD and tFD Data rise and fall time 80 ns
tTIMEO Bus timeout period. If the clock line is held low for this duration of time, the bus state machine is reset. 28 ms