SCES295AB June   2000  – October 2025 SN74LVC1G06

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics: –40°C to +85°C
    7. 5.7 Switching Characteristics: –40°C to +125°C
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 CMOS Open-Drain Outputs
      2. 6.3.2 Standard CMOS Inputs
      3. 6.3.3 Negative Clamping Diodes
      4. 6.3.4 Partial Power Down (Ioff)
      5. 6.3.5 Over-voltage Tolerant Inputs
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPW|5
  • DBV|5
  • DSF|6
  • DCK|5
  • YZV|4
  • DRL|5
  • DRY|6
  • YZP|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74LVC1G06UNIT
DBV
(SOT-23)		DCK
(SC70)		DRL
(SOT-5X3)		DRY
(SON)		DPW
(X2SON)		YZV
(DSBGA)		YZP
(DSBGA)
5 PINS5 PINS5 PINS5 PINS5 PINS4 PINS5 PINS
RθJAJunction-to-ambient thermal resistance357.1371.0296.2369.6511168.2144.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance263.7297.5137.3257.6241.92.11.3°C/W
RθJBJunction-to-board thermal resistance264.4258.6145.3230.8374.255.939.9°C/W
ψJTJunction-to-top characterization parameter195.6195.614.777.2451.10.5°C/W
ψJBJunction-to-board characterization parameter262.2256.2145.9231373.356.339.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/A168N/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.