SLVSO96 October   2026 TICS100MOD

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Resistance Characteristics
    5. 6.5 Electrical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystem
      1. 7.2.1 Arm Cortex-R5F Subsystem
    3. 7.3 Identification
  9. 8 Application Information
    1. 8.1 Typical Application
    2. 8.2 Reset
    3. 8.3 Boot Modes
    4. 8.4 LED Indicators
    5. 8.5 Thermal Considerations
    6. 8.6 PCB Layout Recommendations
    7. 8.7 Protocol Support Details
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Device Nomenclature Boilerplate
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information
  12. 11Revision History

Package Options

Mechanical Data (Package|Pins)
  • 0|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.