SLVSO96 October   2026 TICS100MOD

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Resistance Characteristics
    5. 6.5 Electrical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystem
      1. 7.2.1 Arm Cortex-R5F Subsystem
    3. 7.3 Identification
  9. 8 Application Information
    1. 8.1 Typical Application
    2. 8.2 Reset
    3. 8.3 Boot Modes
    4. 8.4 LED Indicators
    5. 8.5 Thermal Considerations
    6. 8.6 PCB Layout Recommendations
    7. 8.7 Protocol Support Details
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Device Nomenclature Boilerplate
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information
  12. 11Revision History

Package Options

Mechanical Data (Package|Pins)
  • 0|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

TICS100MOD