SLVSO96 October   2026 TICS100MOD

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Resistance Characteristics
    5. 6.5 Electrical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystem
      1. 7.2.1 Arm Cortex-R5F Subsystem
    3. 7.3 Identification
  9. 8 Application Information
    1. 8.1 Typical Application
    2. 8.2 Reset
    3. 8.3 Boot Modes
    4. 8.4 LED Indicators
    5. 8.5 Thermal Considerations
    6. 8.6 PCB Layout Recommendations
    7. 8.7 Protocol Support Details
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Device Nomenclature Boilerplate
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information
  12. 11Revision History

Package Options

Mechanical Data (Package|Pins)
  • 0|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Application Information

Note: Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.