SLOS887G September   2014  – May 2025 TMP112-Q1 , TMP112D-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Specifications for User-Calibrated Systems (TMP112-Q1 Only)
    7. 6.7  Timing Requirements
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics (TMP112-Q1)
    10. 6.10 Typical Application (TMP112D-Q1)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading Operation
        4. 7.3.2.4 Target Mode Operation
          1. 7.3.2.4.1 Target Receiver Mode
          2. 7.3.2.4.2 Target Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed (Hs) Mode
        8. 7.3.2.8 Timeout Function
        9. 7.3.2.9 Timing Diagrams
          1. 7.3.2.9.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 Shutdown Mode (SD)
      4. 7.4.4 One-Shot and Conversion Ready Mode (OS)
      5. 7.4.5 Thermostat Mode (TM)
        1. 7.4.5.1 Comparator Mode (TM = 0)
        2. 7.4.5.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1/F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL)
        9. 7.5.3.9 Conversion Rate (CR)
      4. 7.5.4 High- and Low-Limit Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calibrating for Improved Accuracy (TMP112-Q1 Only)
        1. 8.1.1.1 Example 1: Finding Worst-Case Accuracy From –15°C to 50°C
        2. 8.1.1.2 Example 2: Finding Worst-Case Accuracy From 25°C to 100°C
      2. 8.1.2 Using The Slope Specifications With a 1-Point Calibration (TMP112-Q1 Only)
        1. 8.1.2.1 Power Supply-Level Contribution to Accuracy
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Overview

The TMP112-Q1/TMP112D-Q1 device is a digital temperature sensor that is designed for thermal-management and thermal-protection applications. The TMP112-Q1/TMP112D-Q1 device is two-wire, SMBus and I2C interface-compatible. The device is specified over an operating temperature range of –40°C to 125°C. Figure 7-1 shows a block diagram of the TMP112-Q1/TMP112D-Q1 device. Figure 7-2 and Figure 7-3 illustrate the ESD protection circuitry contained in the TMP112-Q1 and TMP112D-Q1 devices.

The temperature sensor in the TMP112-Q1/TMP112D-Q1 device comprises the whole chip. Thermal paths run through the package leads as well as the plastic package. The package leads provide the primary thermal path because of the lower thermal resistance of the metal.

An alternative version of the TMP112-Q1/TMP112D-Q1 device is available. The TMP102-Q1 device has reduced accuracy, the same micro-package, and is pin-to-pin compatible.

Table 7-1 Advantages of TMP112-Q1 and TMP112D-Q1 vs TMP102-Q1
DeviceCompatible InterfacesPackageSupply CurrentSupply Voltage (Min)Supply Voltage (Max)ResolutionLocal Sensor Accuracy (Max)Specified Calibration Drift Slope
TMP112-Q1I2C
SMBus		SOT563
(1.6 × 1.6 × 0.6)		10µA1.4V3.6V12-bit
0.0625°C		±0.5°C: (0°C to 65°C)
±1°C: (-40°C to 125°C)		Yes
TMP112D-Q1I2C
SMBus		X2SON
(0.8 × 0.8 × 0.4)
SOT563
(1.6 × 1.6 × 0.6)		9µA1.4V3.6V12-bit
0.0625°C		±0.4°C: (0°C to 65°C)
±0.5°C: (-25°C to 85°C)
±0.7°C: (-40°C to 125°C)
No
TMP102-Q1I2C
SMBus		SOT563
(1.6 × 1.6 × 0.6)		10µA1.4V3.6V12-bit
0.0625°C		±2°C: (-25°C to 85°C)
±3°C: (-40°C to 125°C)		No