SLOS887G September   2014  – May 2025 TMP112-Q1 , TMP112D-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Specifications for User-Calibrated Systems (TMP112-Q1 Only)
    7. 6.7  Timing Requirements
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics (TMP112-Q1)
    10. 6.10 Typical Application (TMP112D-Q1)
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading Operation
        4. 7.3.2.4 Target Mode Operation
          1. 7.3.2.4.1 Target Receiver Mode
          2. 7.3.2.4.2 Target Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed (Hs) Mode
        8. 7.3.2.8 Timeout Function
        9. 7.3.2.9 Timing Diagrams
          1. 7.3.2.9.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 Shutdown Mode (SD)
      4. 7.4.4 One-Shot and Conversion Ready Mode (OS)
      5. 7.4.5 Thermostat Mode (TM)
        1. 7.4.5.1 Comparator Mode (TM = 0)
        2. 7.4.5.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1/F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL)
        9. 7.5.3.9 Conversion Rate (CR)
      4. 7.5.4 High- and Low-Limit Registers
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calibrating for Improved Accuracy (TMP112-Q1 Only)
        1. 8.1.1.1 Example 1: Finding Worst-Case Accuracy From –15°C to 50°C
        2. 8.1.1.2 Example 2: Finding Worst-Case Accuracy From 25°C to 100°C
      2. 8.1.2 Using The Slope Specifications With a 1-Point Calibration (TMP112-Q1 Only)
        1. 8.1.2.1 Power Supply-Level Contribution to Accuracy
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The TMP112-Q1 and TMP112D-Q1 devices are digital temperature sensors designed for NTC/PTC thermistor replacement where high accuracy is required. These devices offer an accuracy of ±0.4°C/±0.5°C without requiring calibration or external component signal conditioning. TMP112-Q1 and TMP112D-Q1 are highly linear and do not require complex calculations or lookup tables to derive the temperature. The calibrating for improved accuracy feature in TMP112-Q1 (see the Calibrating for Improved Accuracy section) allows users to calibrate for an accuracy as good as ±0.17°C. The on-chip 12-bit ADC offers resolutions down to 0.0625°C.

TMP112-Q1 and TMP112D-Q1 come with 0.8mm × 0.8mm X2SON (DPW) and 1.6mm × 1.6mm SOT563 (DRL) packages. These devices feature SMBus™, two-wire and I2C interface compatibility, and allow up to four devices on one bus along with SMBus alert function. These devices are specified to operate over 1.4V to 3.6V supply voltage. The maximum quiescent current is around 10µA over the full operating range.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
TMP112-Q1
TMP112D-Q1
SOT563 (6) 1.60mm × 1.60mm
TMP112D-Q1 X2SON (5) 0.8mm × 0.8mm
For all available packages, see the orderable addendum at the end of the data sheet.
The package size (length × width) is a nominal value and includes pins, where applicable.
TMP112-Q1 TMP112D-Q1 Block Diagram (SOT563 Package)Block Diagram (SOT563 Package)