SLOS887G September   2014  – May 2025 TMP112-Q1 , TMP112D-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Specifications for User-Calibrated Systems (TMP112-Q1 Only)
    7. 6.7  Timing Requirements
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics (TMP112-Q1)
    10. 6.10 Typical Application (TMP112D-Q1)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading Operation
        4. 7.3.2.4 Target Mode Operation
          1. 7.3.2.4.1 Target Receiver Mode
          2. 7.3.2.4.2 Target Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed (Hs) Mode
        8. 7.3.2.8 Timeout Function
        9. 7.3.2.9 Timing Diagrams
          1. 7.3.2.9.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 Shutdown Mode (SD)
      4. 7.4.4 One-Shot and Conversion Ready Mode (OS)
      5. 7.4.5 Thermostat Mode (TM)
        1. 7.4.5.1 Comparator Mode (TM = 0)
        2. 7.4.5.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1/F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL)
        9. 7.5.3.9 Conversion Rate (CR)
      4. 7.5.4 High- and Low-Limit Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calibrating for Improved Accuracy (TMP112-Q1 Only)
        1. 8.1.1.1 Example 1: Finding Worst-Case Accuracy From –15°C to 50°C
        2. 8.1.1.2 Example 2: Finding Worst-Case Accuracy From 25°C to 100°C
      2. 8.1.2 Using The Slope Specifications With a 1-Point Calibration (TMP112-Q1 Only)
        1. 8.1.2.1 Power Supply-Level Contribution to Accuracy
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 Typical Application

The TMP112-Q1/TMP112D-Q1 device is used to measure the PCB temperature of the board location where the device is mounted. The programmable address options allow up to four locations on the board to be monitored on a single serial bus.

TMP112-Q1 TMP112D-Q1 Typical Connections (TMP112-Q1)
Note: The SCL, SDA, and ALERT pins require pullup resistors.
Figure 8-3 Typical Connections (TMP112-Q1)
TMP112-Q1 TMP112D-Q1 Typical Connections (TMP112D-Q1)Figure 8-4 Typical Connections (TMP112D-Q1)