SCDS487A October   2025  – December 2025 TMUX4819 , TMUX4821

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Absolute Maximum Ratings
  7. 6 ESD Ratings
  8. 7 Thermal Information
  9. 8 Recommended Operating Conditions
  10. 9 Source or Drain Continuous Current
  11. 10Source or Drain RMS Current
  12. 11Electrical Characteristics 
  13. 12Switching Characteristics 
  14. 13Typical Characteristics
  15. 14Parameter Measurement Information
    1. 14.1  On-Resistance
    2. 14.2  On-Leakage Current
    3. 14.3  Off-Leakage Current
    4. 14.4  Power-Off Leakage Current
    5. 14.5  Propagation Delay
    6. 14.6  tON (VDD) and tOFF (VDD) Time
    7. 14.7  Transition Time
    8. 14.8  Break-Before-Make
    9. 14.9  THD + Noise
    10. 14.10 Power Supply Rejection Ratio (PSRR)
    11. 14.11 Charge Injection
    12. 14.12 Bandwidth
    13. 14.13 Off Isolation
    14. 14.14 Crosstalk
  16. 15Detailed Description
    1. 15.1 Functional Block Diagram
    2. 15.2 Device Functional Modes
    3. 15.3 Feature Description
      1. 15.3.1 Beyond the Supply
      2. 15.3.2 Bidirectional Operation
      3. 15.3.3 Power-Off Protection
      4. 15.3.4 1.2V and 1.8V Logic Compatible Inputs
      5. 15.3.5 Integrated Pull-Down Resistor on Logic Pins
      6. 15.3.6 Fail-Safe Logic
  17. 16Application and Implementation
    1. 16.1 Application Information
    2. 16.2 Typical Applications
      1. 16.2.1 Audio Amplifier Switching
        1. 16.2.1.1 Design Requirements
        2. 16.2.1.2 Detailed Design Procedure
        3. 16.2.1.3 Application Curves
      2. 16.2.2 Smart Drug Delivery Flow Meters
        1. 16.2.2.1 Design Requirements
        2. 16.2.2.2 Detailed Design Procedure
        3. 16.2.2.3 Application Curve
    3. 16.3 Power Supply Recommendations
    4. 16.4 Layout
      1. 16.4.1 Layout Guidelines
      2. 16.4.2 Layout Example
  18. 17Device and Documentation Support
    1. 17.1 Documentation Support
      1. 17.1.1 Related Documentation
    2. 17.2 Receiving Notification of Documentation Updates
    3. 17.3 Support Resources
    4. 17.4 Trademarks
    5. 17.5 Electrostatic Discharge Caution
    6. 17.6 Glossary
  19. 18Revision History
  20. 19Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

16.3 Power Supply Recommendations

The operates across a wide supply range from 1.8V to 5.5V, while supporting input or output signals from -15V to 15V.

Power-supply bypassing improves noise margin and prevents switching noise propagation from the supply rails to other components. Good power-supply decoupling is important to achieve optimum performance. For improved supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF at VDD to ground. Place the bypass capacitors as close to the power supply pin of the device as possible using low-impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes.

For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall inductance and is beneficial for connections to ground and power planes. Always confirm that the ground (GND) connection is established before supplies are ramped.