SCDS487A October   2025  – December 2025 TMUX4819 , TMUX4821

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Absolute Maximum Ratings
  7. 6 ESD Ratings
  8. 7 Thermal Information
  9. 8 Recommended Operating Conditions
  10. 9 Source or Drain Continuous Current
  11. 10Source or Drain RMS Current
  12. 11Electrical Characteristics 
  13. 12Switching Characteristics 
  14. 13Typical Characteristics
  15. 14Parameter Measurement Information
    1. 14.1  On-Resistance
    2. 14.2  On-Leakage Current
    3. 14.3  Off-Leakage Current
    4. 14.4  Power-Off Leakage Current
    5. 14.5  Propagation Delay
    6. 14.6  tON (VDD) and tOFF (VDD) Time
    7. 14.7  Transition Time
    8. 14.8  Break-Before-Make
    9. 14.9  THD + Noise
    10. 14.10 Power Supply Rejection Ratio (PSRR)
    11. 14.11 Charge Injection
    12. 14.12 Bandwidth
    13. 14.13 Off Isolation
    14. 14.14 Crosstalk
  16. 15Detailed Description
    1. 15.1 Functional Block Diagram
    2. 15.2 Device Functional Modes
    3. 15.3 Feature Description
      1. 15.3.1 Beyond the Supply
      2. 15.3.2 Bidirectional Operation
      3. 15.3.3 Power-Off Protection
      4. 15.3.4 1.2V and 1.8V Logic Compatible Inputs
      5. 15.3.5 Integrated Pull-Down Resistor on Logic Pins
      6. 15.3.6 Fail-Safe Logic
  17. 16Application and Implementation
    1. 16.1 Application Information
    2. 16.2 Typical Applications
      1. 16.2.1 Audio Amplifier Switching
        1. 16.2.1.1 Design Requirements
        2. 16.2.1.2 Detailed Design Procedure
        3. 16.2.1.3 Application Curves
      2. 16.2.2 Smart Drug Delivery Flow Meters
        1. 16.2.2.1 Design Requirements
        2. 16.2.2.2 Detailed Design Procedure
        3. 16.2.2.3 Application Curve
    3. 16.3 Power Supply Recommendations
    4. 16.4 Layout
      1. 16.4.1 Layout Guidelines
      2. 16.4.2 Layout Example
  18. 17Device and Documentation Support
    1. 17.1 Documentation Support
      1. 17.1.1 Related Documentation
    2. 17.2 Receiving Notification of Documentation Updates
    3. 17.3 Support Resources
    4. 17.4 Trademarks
    5. 17.5 Electrostatic Discharge Caution
    6. 17.6 Glossary
  19. 18Revision History
  20. 19Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Thermal Information

THERMAL METRIC(1) TMUX48xx UNIT
DSG
8 PINS
RθJA Junction-to-ambient thermal resistance  69.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 84.0 °C/W
RθJB Junction-to-board thermal resistance 35.7 °C/W
ΨJT Junction-to-top characterization parameter 4.0 °C/W
ΨJB Junction-to-board characterization parameter 35.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 14.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.