SCDS487A October   2025  – December 2025 TMUX4819 , TMUX4821

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Absolute Maximum Ratings
  7. 6 ESD Ratings
  8. 7 Thermal Information
  9. 8 Recommended Operating Conditions
  10. 9 Source or Drain Continuous Current
  11. 10Source or Drain RMS Current
  12. 11Electrical Characteristics 
  13. 12Switching Characteristics 
  14. 13Typical Characteristics
  15. 14Parameter Measurement Information
    1. 14.1  On-Resistance
    2. 14.2  On-Leakage Current
    3. 14.3  Off-Leakage Current
    4. 14.4  Power-Off Leakage Current
    5. 14.5  Propagation Delay
    6. 14.6  tON (VDD) and tOFF (VDD) Time
    7. 14.7  Transition Time
    8. 14.8  Break-Before-Make
    9. 14.9  THD + Noise
    10. 14.10 Power Supply Rejection Ratio (PSRR)
    11. 14.11 Charge Injection
    12. 14.12 Bandwidth
    13. 14.13 Off Isolation
    14. 14.14 Crosstalk
  16. 15Detailed Description
    1. 15.1 Functional Block Diagram
    2. 15.2 Device Functional Modes
    3. 15.3 Feature Description
      1. 15.3.1 Beyond the Supply
      2. 15.3.2 Bidirectional Operation
      3. 15.3.3 Power-Off Protection
      4. 15.3.4 1.2V and 1.8V Logic Compatible Inputs
      5. 15.3.5 Integrated Pull-Down Resistor on Logic Pins
      6. 15.3.6 Fail-Safe Logic
  17. 16Application and Implementation
    1. 16.1 Application Information
    2. 16.2 Typical Applications
      1. 16.2.1 Audio Amplifier Switching
        1. 16.2.1.1 Design Requirements
        2. 16.2.1.2 Detailed Design Procedure
        3. 16.2.1.3 Application Curves
      2. 16.2.2 Smart Drug Delivery Flow Meters
        1. 16.2.2.1 Design Requirements
        2. 16.2.2.2 Detailed Design Procedure
        3. 16.2.2.3 Application Curve
    3. 16.3 Power Supply Recommendations
    4. 16.4 Layout
      1. 16.4.1 Layout Guidelines
      2. 16.4.2 Layout Example
  18. 17Device and Documentation Support
    1. 17.1 Documentation Support
      1. 17.1.1 Related Documentation
    2. 17.2 Receiving Notification of Documentation Updates
    3. 17.3 Support Resources
    4. 17.4 Trademarks
    5. 17.5 Electrostatic Discharge Caution
    6. 17.6 Glossary
  19. 18Revision History
  20. 19Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VDD to GND  Supply voltage -0.5 6 V
VSEL to GND Logic control input pin voltage -0.5 6 V
VS or VD to GND Source or drain voltage (Sx, Dx) to ground -17 17 V
VS to VD or VS Source to drain or source (same channel)(4) -18 18 V
Source to drain or source (seperate channel)(3) -24 24 V
ISEL Logic control input pin current -30 30 mA
IS or ID (CONT) Source or drain continuous current (Sx, Dx) IDC + 10 %(5) mA
TA Ambient temperature -55 150 °C
Tstg Storage temperature -65 150 °C
TJ Junction temperature 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) Pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum ratings.
(4) Maximum voltage between source and drain pins within the same channel. For example: S1A to D1 or S1A to S1B
(5) Refer to Source or Drain Continuous Current table for IDC specifications.