SCDS397B November   2018  – August 2025 TMUX6136

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics (Dual Supplies: ±15V)
    6. 5.6 Switching Characteristics (Dual Supplies: ±15V)
    7. 5.7 Electrical Characteristics (Single Supply: 12V)
    8. 5.8 Switching Characteristics (Single Supply: 12V)
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1  On-Resistance
      2. 6.1.2  Off-Leakage Current
      3. 6.1.3  On-Leakage Current
      4. 6.1.4  Transition Time
      5. 6.1.5  Break-Before-Make Delay
      6. 6.1.6  Charge Injection
      7. 6.1.7  Off Isolation
      8. 6.1.8  Channel-to-Channel Crosstalk
      9. 6.1.9  Bandwidth
      10. 6.1.10 THD + Noise
      11. 6.1.11 AC Power Supply Rejection Ratio (AC PSRR)
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Ultralow Leakage Current
      2. 6.3.2 Ultralow Charge Injection
      3. 6.3.3 Bidirectional and Rail-to-Rail Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Truth Table
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1 Layout Guidelines

Figure 9-1 shows an example of a PCB layout with the TMUX6136.

Some key considerations are as follows:

  1. Decouple the VDD and VSS pins with a 0.1µF capacitor, placed as close to the pin as possible. Make sure that the capacitor voltage rating is sufficient for the VDD and VSS supplies.
  2. Keep the input lines as short as possible.
  3. Use a solid ground plane to help distribute heat and reduce electromagnetic interference (EMI) noise pickup.
  4. Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when necessary.