SLVSHA1C September   2024  – August 2025 TPS1685

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Logic Interface
    7. 6.7 Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Undervoltage Protection
      2. 7.3.2  Insertion Delay
      3. 7.3.3  Overvoltage Protection
      4. 7.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 7.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 7.3.4.1.1 Start-Up Time Out
        2. 7.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 7.3.4.3 Active Current Limiting During Start-Up
        4. 7.3.4.4 Short-Circuit Protection
      5. 7.3.5  Analog Load Current Monitor (IMON)
      6. 7.3.6  Mode Selection (MODE)
      7. 7.3.7  Parallel Device Synchronization (SWEN)
      8. 7.3.8  Stacking Multiple eFuses for Unlimited Scalability
        1. 7.3.8.1 Current Balancing During Start-Up
      9. 7.3.9  Analog Junction Temperature Monitor (TEMP)
      10. 7.3.10 Overtemperature Protection
      11. 7.3.11 Fault Response and Indication (FLT)
      12. 7.3.12 Power Good Indication (PG)
      13. 7.3.13 Output Discharge
      14. 7.3.14 FET Health Monitoring
      15. 7.3.15 Single Point Failure Mitigation
        1. 7.3.15.1 IMON Pin Single Point Failure
        2. 7.3.15.2 IREF Pin Single Point Failure
        3. 7.3.15.3 ITIMER Pin Single Point Failure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single Device, Standalone Operation
      2. 8.1.2 Multiple Devices, Parallel Connection
    2. 8.2 Typical Application: 54V Power Path Protection in Data Center Servers
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Transient Protection
      2. 8.3.2 Output Short-Circuit Measurements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • VMA|23
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Device Functional Modes

The features of the device depend on the operating mode. Table 7-6 and Table 7-7 summarize the device functional modes.

Table 7-6 Device Functional Modes Based on EN/UVLO Pin

Pin: EN/UVLO

Device State

Output Discharge

> VUVLO(R)

Fully ON

Disabled

> VSD(F), < VUVLO(F) (< tQOD)

FET OFF

Disabled

> VSD(F), < VUVLO(F) (> tQOD)FET OFFEnabled

< VSD(F)

Shutdown

Disabled

Table 7-7 Device Functional Modes Based on MODE Pin

Pin: MODE

Device Configuration

Open

Primary or standalone

GND

Secondary

Table 7-8 Device Functional Modes Based on Resistor at SFT_SEL Pin

ISFT_SEL

 SFT_SEL pin

MODE pin

IOC_BKP

RSFT_SEL <95kΩ

Open

2.5 × IOCP

105kΩ < RSFT_SEL < 195kΩ

Open

2.8 × IOCP

105kΩ < RSFT_SEL < 195kΩ

GND

2 × IOCP

205kΩ < RSFT_SEL < 295kΩ

Open

2.26 × IOCP

205kΩ < RSFT_SEL < 295kΩ

GND

1.5 × IOCP

305kΩ < RSFT_SEL

Open

1.71 × IOCP

305kΩ < RSFT_SEL

GND