SLVSHA1C September   2024  – August 2025 TPS1685

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Logic Interface
    7. 6.7 Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Undervoltage Protection
      2. 7.3.2  Insertion Delay
      3. 7.3.3  Overvoltage Protection
      4. 7.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 7.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 7.3.4.1.1 Start-Up Time Out
        2. 7.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 7.3.4.3 Active Current Limiting During Start-Up
        4. 7.3.4.4 Short-Circuit Protection
      5. 7.3.5  Analog Load Current Monitor (IMON)
      6. 7.3.6  Mode Selection (MODE)
      7. 7.3.7  Parallel Device Synchronization (SWEN)
      8. 7.3.8  Stacking Multiple eFuses for Unlimited Scalability
        1. 7.3.8.1 Current Balancing During Start-Up
      9. 7.3.9  Analog Junction Temperature Monitor (TEMP)
      10. 7.3.10 Overtemperature Protection
      11. 7.3.11 Fault Response and Indication (FLT)
      12. 7.3.12 Power Good Indication (PG)
      13. 7.3.13 Output Discharge
      14. 7.3.14 FET Health Monitoring
      15. 7.3.15 Single Point Failure Mitigation
        1. 7.3.15.1 IMON Pin Single Point Failure
        2. 7.3.15.2 IREF Pin Single Point Failure
        3. 7.3.15.3 ITIMER Pin Single Point Failure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single Device, Standalone Operation
      2. 8.1.2 Multiple Devices, Parallel Connection
    2. 8.2 Typical Application: 54V Power Path Protection in Data Center Servers
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Transient Protection
      2. 8.3.2 Output Short-Circuit Measurements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • VMA|23
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.6 Mode Selection (MODE)

This pin can be used to configure the TPS1685x as a primary device in a chain along with other TPS1685x eFuses, designated as secondary devices. This feature allows some of the TPS1685x pin functions to be changed to aid the primary and secondary parallel connection.

This pin is sampled at power up. Leaving the pin open configures the pin as a primary or standalone device. Connecting this pin to GND configures the pin as a secondary device.

The following functions are disabled in secondary mode and the device relies on the primary device to provide this functionality:

  1. IREF internal current source
  2. DVDT internal current source
  3. Overcurrent detection in steady-state for circuit-breaker response
  4. PG de-assertion (pulldown) after reaching steady-state
  5. Latch-off after fault

In secondary mode, the following functions are still active:

  1. Overtemperature protection
  2. Start-up current limit
  3. Active current sharing during inrush as well as steady-state
  4. Analog current monitor (IMON) in steady state
  5. Steady-state overcurrent detection based on IMON. This is indicated by pulling ITIMER pin low internally, but does not trigger circuit-breaker action on ITIMER expiry. Rather, the pin relies on the primary device to start a dedicated ITIMER and then trigger the circuit-breaker action for the whole chain by pulling SWEN low after the ITIMER expiry. However, the secondary devices use an internal overcurrent timer as a backup in case the primary device fails to initiate circuit-breaker action for an extended period of time. Refer to Single Point Failure Mitigation section for details.
  6. Each device still has individual scalable and fixed fast-trip thresholds to protect itself. The individual short-circuit protection threshold is set to higher values in secondary mode so that the primary device can lower it further for the whole system.
  7. Individual OVP is set to maximum in secondary device so that the primary can lower individual OVP further for the whole system.
  8. FLT assertion based on individual device fault detection (except circuit-breaker).
  9. PG de-assertion control during inrush and assertion control after device reaches steady state. However, after that in steady state, the secondary device no longer controls the de-assertion of the PG in case of faults.
  10. SWEN assertion or de-assertion based on internal events as well as FET ON and OFF control based on SWEN pin status.

In secondary mode, the device behavior during short-circuit and fast-trip is also altered. More details are available in the Short-Circuit Protection section.