SLVSHA1C September   2024  – August 2025 TPS1685

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Logic Interface
    7. 6.7 Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Undervoltage Protection
      2. 7.3.2  Insertion Delay
      3. 7.3.3  Overvoltage Protection
      4. 7.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 7.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 7.3.4.1.1 Start-Up Time Out
        2. 7.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 7.3.4.3 Active Current Limiting During Start-Up
        4. 7.3.4.4 Short-Circuit Protection
      5. 7.3.5  Analog Load Current Monitor (IMON)
      6. 7.3.6  Mode Selection (MODE)
      7. 7.3.7  Parallel Device Synchronization (SWEN)
      8. 7.3.8  Stacking Multiple eFuses for Unlimited Scalability
        1. 7.3.8.1 Current Balancing During Start-Up
      9. 7.3.9  Analog Junction Temperature Monitor (TEMP)
      10. 7.3.10 Overtemperature Protection
      11. 7.3.11 Fault Response and Indication (FLT)
      12. 7.3.12 Power Good Indication (PG)
      13. 7.3.13 Output Discharge
      14. 7.3.14 FET Health Monitoring
      15. 7.3.15 Single Point Failure Mitigation
        1. 7.3.15.1 IMON Pin Single Point Failure
        2. 7.3.15.2 IREF Pin Single Point Failure
        3. 7.3.15.3 ITIMER Pin Single Point Failure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single Device, Standalone Operation
      2. 8.1.2 Multiple Devices, Parallel Connection
    2. 8.2 Typical Application: 54V Power Path Protection in Data Center Servers
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Transient Protection
      2. 8.3.2 Output Short-Circuit Measurements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • VMA|23
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.4.3 Active Current Limiting During Start-Up

The TPS1685x responds to output overcurrent conditions during start-up by actively limiting the current. The startup current limit is internally fixed to Istart-up.

When the load current during start-up exceeds IStart-up, the device tries to regulate and hold the load current at IStart-up.

During current regulation, the output voltage drops, resulting in increased device power dissipation across the FET. If the device internal temperature (TJ) exceeds the thermal shutdown threshold (TSD), the FET is turned off. After the part shuts down due to a TSD fault, the device either stays latched off (TPS16851 variants) or restarts automatically after a fixed delay (TPS16850 variants). See Overtemperature protection section for more details on device response to overtemperature.

Note:

The active current limit block employs a foldback mechanism during start-up based on the output voltage (VOUT). When VOUT is below the foldback threshold (VFB), the current limit threshold is further lowered.