SLVSER6B May   2020  – November 2020 TPS23730

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: DC-DC Controller Section
    6. 7.6 Electrical Characteristics PoE
    7.     14
    8. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  CLSA, CLSB Classification
      2. 8.3.2  DEN Detection and Enable
      3. 8.3.3  APD Auxiliary Power Detect
      4. 8.3.4  PPD Power Detect
      5. 8.3.5  Internal Pass MOSFET
      6. 8.3.6  TPH, TPL and BT PSE Type Indicators
      7. 8.3.7  DC-DC Controller Features
        1. 8.3.7.1 VCC, VB, VBG and Advanced PWM Startup
        2.       28
        3. 8.3.7.2 CS, Current Slope Compensation and Blanking
        4. 8.3.7.3 COMP, FB, EA_DIS, CP, PSRS and Opto-less Feedback
        5. 8.3.7.4 FRS Frequency Setting and Synchronization
        6. 8.3.7.5 DTHR and Frequency Dithering for Spread Spectrum Applications
        7. 8.3.7.6 SST and Soft-Start of the Switcher
        8. 8.3.7.7 SST, I_STP, LINEUV and Soft-Stop of the Switcher
      8. 8.3.8  Switching FET Driver - GATE, GTA2, DT
      9. 8.3.9  EMPS and Automatic MPS
      10. 8.3.10 VDD Supply Voltage
      11. 8.3.11 RTN, AGND, GND
      12. 8.3.12 VSS
      13. 8.3.13 Exposed Thermal pads - PAD_G and PAD_S
    4. 8.4 Device Functional Modes
      1. 8.4.1  PoE Overview
      2. 8.4.2  Threshold Voltages
      3. 8.4.3  PoE Start-Up Sequence
      4. 8.4.4  Detection
      5. 8.4.5  Hardware Classification
      6. 8.4.6  Maintain Power Signature (MPS)
      7. 8.4.7  Advanced Start-Up and Converter Operation
      8. 8.4.8  Line Undervoltage Protection and Converter Operation
      9. 8.4.9  PD Self-Protection
      10. 8.4.10 Thermal Shutdown - DC-DC Controller
      11. 8.4.11 Adapter ORing
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Detailed Design Procedure
          1. 9.2.1.1.1  Input Bridges and Schottky Diodes
          2. 9.2.1.1.2  Input TVS Protection
          3. 9.2.1.1.3  Input Bypass Capacitor
          4. 9.2.1.1.4  Detection Resistor, RDEN
          5. 9.2.1.1.5  Classification Resistor, RCLSA and RCLSB.
          6. 9.2.1.1.6  Dead Time Resistor, RDT
          7. 9.2.1.1.7  APD Pin Divider Network, RAPD1, RAPD2
          8. 9.2.1.1.8  PPD Pin Divider Network, RPPD1, RPPD2
          9. 9.2.1.1.9  Setting Frequency (RFRS) and Synchronization
          10. 9.2.1.1.10 Bias Supply Requirements and CVCC
          11. 9.2.1.1.11 TPH, TPL, and BT Interface
          12. 9.2.1.1.12 Secondary Soft Start
          13. 9.2.1.1.13 Frequency Dithering for Conducted Emissions Control
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 EMI Containment
    4. 11.4 Thermal Considerations and OTSD
    5. 11.5 ESD
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

CLSA, CLSB Classification

Each of the two external resistors (RCLSA and RCLSB in Figure 9-1) connected between the CLSA (first and second class event) and CLSB (third and any subsequent class event) pins and VSS provide a distinct classification signature to the PSE, and are used to define the power class requested by the PD. The controller places a voltage of approximately 1.25 V across CLSA (first or second class event) or CLSB (all additional class events) external resistor whenever the voltage differential between VDD and VSS lies from about 11 V to 22 V. The current drawn by each resistor, combined with the internal current drain of the controller and any leakage through the internal pass MOSFET, creates the classification signature current. Table 8-1 lists the external resistor values required for each of the PD power ranges defined by IEEE802.3bt. The number of classification cycles then determines how much power is allocated by the PSE. The maximum average power drawn by the PD, plus the power supplied to the downstream load, should not exceed the maximum power indicated in Table 8-1, as well as the maximum power allocated by the PSE based on the number of classification cycles. Holding APD high disables the classification signatures.

Type 2 and Type 3 PSEs may perform two classification cycles if Class 4 signature is presented on the first cycle. Likewise, Type 3 and Type 4 PSEs may perform four classification cycles if Class 4 signature is presented on the first two cycles and Class 0 or 1 signature is presented on the third cycle.

Table 8-1 Class Resistor Selection
PD CLASSCLASS SIGNATURE ACLASS SIGNATURE BMINIMUM POWER AT PD (W)MAXIMUM POWER AT PD (W)NUMBER OF CLASS CYCLES @ MAX POWERRESISTOR CLSA (Ω)RESISTOR CLSB (Ω)
0000.4412.951806806
1110.443.841130130
2223.846.49169.869.8
3336.4912.95146.446.4
44412.9525.52,33232
54025.540432806
6414051432130