SLVSER6B May   2020  – November 2020 TPS23730

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: DC-DC Controller Section
    6. 7.6 Electrical Characteristics PoE
    7.     14
    8. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  CLSA, CLSB Classification
      2. 8.3.2  DEN Detection and Enable
      3. 8.3.3  APD Auxiliary Power Detect
      4. 8.3.4  PPD Power Detect
      5. 8.3.5  Internal Pass MOSFET
      6. 8.3.6  TPH, TPL and BT PSE Type Indicators
      7. 8.3.7  DC-DC Controller Features
        1. 8.3.7.1 VCC, VB, VBG and Advanced PWM Startup
        2.       28
        3. 8.3.7.2 CS, Current Slope Compensation and Blanking
        4. 8.3.7.3 COMP, FB, EA_DIS, CP, PSRS and Opto-less Feedback
        5. 8.3.7.4 FRS Frequency Setting and Synchronization
        6. 8.3.7.5 DTHR and Frequency Dithering for Spread Spectrum Applications
        7. 8.3.7.6 SST and Soft-Start of the Switcher
        8. 8.3.7.7 SST, I_STP, LINEUV and Soft-Stop of the Switcher
      8. 8.3.8  Switching FET Driver - GATE, GTA2, DT
      9. 8.3.9  EMPS and Automatic MPS
      10. 8.3.10 VDD Supply Voltage
      11. 8.3.11 RTN, AGND, GND
      12. 8.3.12 VSS
      13. 8.3.13 Exposed Thermal pads - PAD_G and PAD_S
    4. 8.4 Device Functional Modes
      1. 8.4.1  PoE Overview
      2. 8.4.2  Threshold Voltages
      3. 8.4.3  PoE Start-Up Sequence
      4. 8.4.4  Detection
      5. 8.4.5  Hardware Classification
      6. 8.4.6  Maintain Power Signature (MPS)
      7. 8.4.7  Advanced Start-Up and Converter Operation
      8. 8.4.8  Line Undervoltage Protection and Converter Operation
      9. 8.4.9  PD Self-Protection
      10. 8.4.10 Thermal Shutdown - DC-DC Controller
      11. 8.4.11 Adapter ORing
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Detailed Design Procedure
          1. 9.2.1.1.1  Input Bridges and Schottky Diodes
          2. 9.2.1.1.2  Input TVS Protection
          3. 9.2.1.1.3  Input Bypass Capacitor
          4. 9.2.1.1.4  Detection Resistor, RDEN
          5. 9.2.1.1.5  Classification Resistor, RCLSA and RCLSB.
          6. 9.2.1.1.6  Dead Time Resistor, RDT
          7. 9.2.1.1.7  APD Pin Divider Network, RAPD1, RAPD2
          8. 9.2.1.1.8  PPD Pin Divider Network, RPPD1, RPPD2
          9. 9.2.1.1.9  Setting Frequency (RFRS) and Synchronization
          10. 9.2.1.1.10 Bias Supply Requirements and CVCC
          11. 9.2.1.1.11 TPH, TPL, and BT Interface
          12. 9.2.1.1.12 Secondary Soft Start
          13. 9.2.1.1.13 Frequency Dithering for Conducted Emissions Control
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 EMI Containment
    4. 11.4 Thermal Considerations and OTSD
    5. 11.5 ESD
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-69F7C776-1CA7-44A8-966E-84BD48B2B5A2-low.gif Figure 6-1 RMT Package45-Pin VQFNTop View
Table 6-1 Pin Functions
PIN I/O DESCRIPTION
NO. NAME
1 CS I/O DC-DC controller current sense input. Connect directly to the external power current sense resistor.
2 AGND - AGND is the DC-DC converter analog return. Tie to RTN and GND on the circuit board.
3 DTHR O Used for spread spectrum frequency dithering. Connect a capacitor (determines the modulating frequency) from DTHR to RTN and a resistor (determines the amount of dithering) from DTHR to FRS. If dithering is not used, short DTHR to VB pin.
4 FRS I This pin controls the switching frequency of the DC-DC converter. Tie a resistor from this pin to RTN to set the frequency.
5 APD I Primary auxiliary power detect input. Raise 1.5 V above RTN to disable pass MOSFET, also turning class off. If not used, connect APD to RTN.
7, 8, 9 RTN - RTN is the output of the PoE hotswap and the reference ground for the DC-DC controller.
11 EMPS I Automatic MPS enable input, referenced to RTN, internally pulled-up to 5-V internal rail. Tie to RTN to disable automatic MPS.
12 BT O Indicates that a PSE applying an IEEE802.3bt (Type 3 or 4) mutual identification scheme has been identified. Open-drain, active-low output referenced to RTN. BT state remains unchanged if an auxiliary power adapter is detected via APD or PPD input. BT is also disabled if SCDIS is low.
13 TPH O TPH/TPL binary code indicates the PSE allocated power output. Open-drain, active-low outputs referenced to RTN. The default operation is with parallel binary code. Also, whenever an auxiliary power adapter is detected via the APD input or PPD input, both TPH and TPL pull low. Serial code over TPL can also be enabled by tying SCDIS pin to VSS. In this case, TPH becomes high impedance.
14 TPL O
17 REF O Internal 1.25-V voltage reference. Connect a 49.9-kΩ_1% resistor from REF to VSS.
18 SCDIS I TPL serial code disable, referenced to VSS. Leave open to select parallel TPH/TPL configuration. Tie to VSS to select serial code.
19 PPD I Raising VPPD-VSS above 2.5 V enables the hotswap MOSFET, activates TPH and TPL and turn class off. Tie PPD to VSS or float when not used.
20 CLSB O Connect a resistor from CLSB to VSS to program the second classification current.
21 CLSA O Connect a resistor from CLSA to VSS to program the first classification current.
23 VDD — Positive input power rail for PoE interface circuit and source of DC-DC converter start-up current. Bypass with a 0.1 µF to VSS and protect with a TVS.
24 DEN I/O Connect a 25.5-kΩ resistor from DEN to VDD to provide the PoE detection signature. Pulling this pin to VSS during powered operation causes the internal hotswap MOSFET to turn off.
27, 28 VSS - Negative power rail derived from the PoE source.
30 TEST O Used internally for test purposes only. Leave open.
31 DT I Connect a resistor from DT to AGND to set the GATE to GAT2 dead time. Tie DT to VB to disable GAT2 operation.
32 I_STP I This pin sets the SST discharge current during a soft-stop event independently from the setting used during a regular soft-start event. Connect a resistor from this pin to AGND to set the DC/DC soft-stop rate.
33 SST I/O A capacitor from SST to RTN pin sets the soft-start (ISSC charge current) and the hiccup timer (ISSD discharge current) for the DC-DC converter. Connect a capacitor from this pin to RTN to set the DC/DC startup rate.
34 FB I Converter error amplifier inverting (feedback) input. If flyback configuration with primary-side regulation, it is typically driven by a voltage divider and capacitor from the auxiliary winding, working with CP pin, FB also being connected to the COMP compensation network. If optocoupler feedback is enabled, tie FB to VB.
35 COMP I/O Compensation output of the DC-DC convertor error amplifier or control loop input to the PWM. If the internal error amplifier is used, connect the compensation networks from this pin to the FB pin to compensate the converter. If optocoupler feedback is enabled, the optocoupler and its network pulled up to VB directly drives the COMP pin.
36 EA_DIS I Error Amplifier disable input, referenced to AGND, internally pulled-up to 5V internal rail. Leave EA_DIS open to disable the Error amplifier, to enable optocoupler feedback for example. Connect to AGND otherwise.
37 VB O 5-V bias rail for DC/DC control circuits and the feedback optocoupler (when in use). Connect a 0.1-uF capacitor from this pin to AGND to provide bypassing.
38 LINEUV I LINEUV is used to monitor the bulk capacitor voltage to trigger a soft-stop event when an undervoltage condition is detected if APD is low. If not used, connect LINEUV to VB pin.
39 PSRS I PSR Sync enable input, referenced to AGND, internally pulled-up to 5V internal rail. PSRS works with CP pin to support flyback architecture using primary-side regulation. Leave PSRS open if the flyback output stage is configured with synchronous rectification and uses PSR. If diode rectification is used, or for applications not using PSR, connect PSRS to AGND.
40 VBG O 5-V bias rail for the switching FET gate driver circuit. For internal use only. Bypass with a 0.1-μF ceramic capacitor to GND pin.
41 GAT2 O Gate drive output for a second DC-DC converter switching MOSFET.
42 VCC I/O DC/DC converter bias voltage. The internal startup current source and converter bias winding output power this pin. Connect a 1µF minimum ceramic capacitor to RTN.
43 GATE O Gate drive output for the main DC-DC converter switching MOSFET
44 CP O CP provides the clamp for the primary-side regulation loop. Connect this pin to the lower end of the bias winding of the flyback transformer.
45 GND - .Power ground used by the flyback power FET gate driver and CP. Connect to RTN.
6, 10, 15, 16, 22, 25, 26, 29 NC - No connect pin. Leave open.
47 PAD_S - The exposed thermal pad must be connected to VSS. A large fill area is required to assist in heat dissipation.
46 PAD_G - The exposed thermal pad must be connected to RTN. A large fill area is required to assist in heat dissipation.