SLVSDW2B December   2018  – November 2020 TPS23755

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: DC-DC Controller Section
    6. 6.6 Electrical Characteristics: PoE and Control
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  CLS Classification
      2. 7.3.2  DEN Detection and Enable
      3. 7.3.3  Internal Pass MOSFET
      4. 7.3.4  DC-DC Controller Features
        1. 7.3.4.1 VCC, VB and Advanced PWM Startup
        2. 7.3.4.2 CS, Current Slope Compensation and Blanking
        3. 7.3.4.3 COMP, FB, CP and Opto-less Feedback
        4. 7.3.4.4 FRS Frequency Setting and Synchronization
        5. 7.3.4.5 Frequency Dithering for Spread Spectrum Applications
        6. 7.3.4.6 SST and Soft-Start of the Switcher
        7. 7.3.4.7 AUX_V, AUX_D and Secondary Adapter Or'ing
      5. 7.3.5  Internal Switching FET - DRAIN, RSNS, SRF and SRR
      6. 7.3.6  VPD Supply Voltage
      7. 7.3.7  VDD Supply Voltage
      8. 7.3.8  GND
      9. 7.3.9  VSS
      10. 7.3.10 Exposed Thermal PAD
    4. 7.4 Device Functional Modes
      1. 7.4.1 PoE Overview
      2. 7.4.2 Threshold Voltages
      3. 7.4.3 PoE Start-Up Sequence
      4. 7.4.4 Detection
      5. 7.4.5 Hardware Classification
      6. 7.4.6 Maintain Power Signature (MPS)
      7. 7.4.7 Start-Up and Converter Operation
      8. 7.4.8 PD Self-Protection
      9. 7.4.9 Adapter ORing
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Input Bridges and Schottky Diodes
        2. 8.2.2.2  Protection, D1
        3. 8.2.2.3  Capacitor, C1
        4. 8.2.2.4  Detection Resistor, RDEN
        5. 8.2.2.5  Classification Resistor, RCLS
        6. 8.2.2.6  Bulk Capacitance, CBULK
        7. 8.2.2.7  Output Voltage Feedback Divider, RAUX, R1,R2
        8. 8.2.2.8  Setting Frequency, RFRS
        9. 8.2.2.9  Frequency Dithering, RDTR and CDTR
        10. 8.2.2.10 Bias Voltage, CVB and DVB
        11. 8.2.2.11 Transformer design, T1
        12. 8.2.2.12 Current Sense Resistor, RCS
        13. 8.2.2.13 Current Slope Compensation, RS
        14. 8.2.2.14 Bias Supply Requirements, CCC, DCC
        15. 8.2.2.15 Switching Transformer Considerations, RVCC and CCC2
        16. 8.2.2.16 Primary FET Clamping, RCL, CCL, and DCL
        17. 8.2.2.17 Converter Output Capacitance, COUT
        18. 8.2.2.18 Secondary Output Diode Rectifier, DOUT
        19. 8.2.2.19 Slew rate control, RSRF and RSRR
        20. 8.2.2.20 Shutdown at Low Temperatures, DVDD and CVDD
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related documentation
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • RJJ|23
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Input Bridges and Schottky Diodes

Using Schottky diodes instead of PN junction diodes for the PoE input bridges reduces the power dissipation in these devices by about 30%. There are, however, some things to consider when using them. The IEEE standard specifies a maximum backfeed voltage of 2.8 V. A 100-kΩ resistor is placed between the unpowered pairs and the voltage is measured across the resistor. Schottky diodes often have a higher reverse leakage current than PN diodes, making this a harder requirement to meet. To compensate, use conservative design for diode operating temperature, select lower-leakage devices where possible, and match leakage and temperatures by using packaged bridges.

Schottky diode leakage currents and lower dynamic resistances can impact the detection signature. Setting reasonable expectations for the temperature range over which the detection signature is accurate is the simplest solution. Increasing RDEN slightly may also help meet the requirement.

Schottky diodes have proven less robust to the stresses of ESD transients than PN junction diodes. After exposure to ESD, Schottky diodes may become shorted or leak. Care must be taken to provide adequate protection in line with the exposure levels. This protection may be as simple as ferrite beads and capacitors.

As a general recommendation, use 0.8 A-1 A, 100-V rated discrete or bridge diodes for the input rectifiers.