SLVSAX2B September   2011  – June 2020 TPS61170-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start-up
      2. 7.3.2 Overcurrent Protection
      3. 7.3.3 Undervoltage Lockout
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 Enable and Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Program Mode
      2. 7.4.2 1-Wire Program Mode
      3. 7.4.3 EasyScale
    5. 7.5 Programming
      1. 7.5.1 Feedback Reference Program Mode Selection
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 12-V to 24-V DC-DC Power Conversion
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Program Output Voltage
          2. 8.2.1.2.2 Maximum Output Current
          3. 8.2.1.2.3 Switch Duty Cycle
          4. 8.2.1.2.4 Inductor Selection
          5. 8.2.1.2.5 Schottky Diode Selection
          6. 8.2.1.2.6 Compensation Capacitor Selection
          7. 8.2.1.2.7 Input and Output Capacitor Selection
        3. 8.2.1.3 Application Curve
      2. 8.2.2 5-V to 12-V DC-DC Power Conversion With Programmable Feedback Reference Voltage
      3. 8.2.3 12-V SEPIC (Buck-Boost) Converter
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

As for all switching power supplies, especially those switching at high frequencies and/or providing high currents, layout is an important design step. If layout is not carefully done, the regulator could suffer from instability as well as noise problems. To maximize efficiency, switch rise and fall times should be as short as possible. To reduce radiation of high-frequency switching noise and harmonics, proper layout of the high-frequency switching path is essential. Minimize the length and area of all traces connected to the SW pin and always use a ground plane under the switching regulator to minimize interplane coupling. The high current path including the switch, Schottky diode, and output capacitor, contains nanosecond rise and fall times and should be kept as short as possible. The input capacitor needs not only to be close to the VIN pin, but also to the GND pin to reduce the IC supply ripple. Figure 20 shows a sample layout.