SLVSFS6A May   2021  – September 2021 TPS629210-Q1

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Mode Selection and Device Configuration (MODE/S-CONF Pin)
      2. 8.3.2 Adjustable VO Operation (External Voltage Divider)
      3. 8.3.3 Settable VO Operation (VSET and Internal Voltage Divider)
      4. 8.3.4 Smart Enable with Precise Threshold
      5. 8.3.5 Power Good (PG)
      6. 8.3.6 Undervoltage Lockout (UVLO)
      7. 8.3.7 Current Limit and Short Circuit Protection
      8. 8.3.8 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Forced Pulse Width Modulation (PWM) Operation
      2. 8.4.2 AEE (Automatic Efficiency Enhancement)
      3. 8.4.3 Power Save Mode Operation (Auto PFM/PWM)
      4. 8.4.4 100% Duty-Cycle Operation
      5. 8.4.5 Output Discharge Function
      6. 8.4.6 Starting into a Pre-Biased Load
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 External Component Selection
        1. 9.1.1.1 Programming the Output Voltage
        2. 9.1.1.2 Inductor Selection
        3. 9.1.1.3 Capacitor Selection
          1. 9.1.1.3.1 Output Capacitor
          2. 9.1.1.3.2 Input Capacitor
        4. 9.1.1.4 Output Filter and Loop Stability
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

A proper layout is critical for the operation of a switched mode power supply, even more at high switching frequencies. Therefore, the PCB layout of the TPS629210-Q1 demands careful attention to ensure operation and to get the performance specified. A poor layout can lead to issues like the following:

  • Poor regulation (both line and load)
  • Stability and accuracy weaknesses
  • Increased EMI radiation
  • Noise sensitivity

See Figure 11-1 for the recommended layout of the TPS629210-Q1, which is designed for common external ground connections. The input capacitor should be placed as close as possible between the VIN and GND pin of the TPS629210-Q1.

Provide low inductive and resistive paths for loops with high di/dt. Therefore, paths conducting the switched load current should be as short and wide as possible. Provide low capacitive paths (with respect to all other nodes) for wires with high dv/dt. Therefore, the input and output capacitance should be placed as close as possible to the IC pins and parallel wiring over long distances as well as narrow traces should be avoided. Loops which conduct an alternating current should outline an area as small as possible, as this area is proportional to the energy radiated.

Sensitive nodes like FB and VOS need to be connected with short wires and not nearby high dv/dt signals (for example, SW). As they carry information about the output voltage, they should be connected as close as possible to the actual output voltage (at the output capacitor). The FB resistors, R1 and R2, should be kept close to the IC and connect directly to those pins and the system ground plane. The same applies for the S-CONFIG/MODE and VSET programming resitors.

The package uses the pins for power dissipation. Thermal vias on the VIN, GND, and SW pins help to spread the heat through the PCB.

In case any of the digital inputs (EN, VSET or MODE) need to be tied to the input supply voltage at VIN, the connection must be made directly at the input capacitor as indicated in the schematics.

The recommended layout is implemented on the EVM and shown in the TPS629210EVM-Q1 User's Guide).