SLVSIH4 August   2025 TPS6521505-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  System Control Thresholds
    6. 5.6  BUCK1 Converter
    7. 5.7  BUCK2, BUCK3 Converter
    8. 5.8  General Purpose LDOs (LDO1)
    9. 5.9  General Purpose LDOs (LDO2)
    10. 5.10 GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO1, GPO2, GPIO, MODE/RESET, MODE/STBY, VSEL_SD/VSEL_DDR)
    11. 5.11 Voltage and Temperature Monitors
    12. 5.12 I2C Interface
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Power-Up Sequencing
      2. 6.3.2  Power-Down Sequencing
      3. 6.3.3  Push Button and Enable Input (EN/PB/VSENSE)
      4. 6.3.4  Reset to SoC (nRSTOUT)
      5. 6.3.5  Buck Converters (Buck1, Buck2, and Buck3)
        1. 6.3.5.1 Dual Random Spread Spectrum (DRSS)
      6. 6.3.6  Linear Regulators (LDO1 and LDO2)
      7. 6.3.7  Interrupt Pin (nINT)
      8. 6.3.8  PWM/PFM and Low Power Modes (MODE/STBY)
      9. 6.3.9  PWM/PFM and Reset (MODE/RESET)
      10. 6.3.10 Voltage Select Pin (VSEL_SD/VSEL_DDR)
      11. 6.3.11 General Purpose Inputs or Outputs (GPO1, GPO2, and GPIO)
      12. 6.3.12 I2C-Compatible Interface
        1. 6.3.12.1 Data Validity
        2. 6.3.12.2 Start and Stop Conditions
        3. 6.3.12.3 Transferring Data
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
        1. 6.4.1.1 OFF State
        2. 6.4.1.2 INITIALIZE State
        3. 6.4.1.3 ACTIVE State
        4. 6.4.1.4 STBY State
        5. 6.4.1.5 Fault Handling
    5. 6.5 Multi-PMIC Operation
    6. 6.6 NVM Programming
      1. 6.6.1 TPS6521505-Q1 default NVM settings
      2. 6.6.2 NVM programming in Initialize State
      3. 6.6.3 NVM Programming in Active State
    7. 6.7 User Registers
    8. 6.8 Device Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application Example
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Buck1, Buck2, Buck3 Design Procedure
        2. 7.2.3.2 LDO1 Design Procedure
        3. 7.2.3.3 LDO2 Design Procedure
        4. 7.2.3.4 VSYS, VDD1P8
        5. 7.2.3.5 Digital Signals Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.3 Detailed Design Procedure

This section describes the design procedure for each of the power modules integrated in the TPS6521505-Q1 PMIC. Please note, most of the external component values that are mentioned in this section are based on the typical spec. For minimum and maximum values, refer to the corresponding parameter in the Specifications section.