SLVSCO4D July 2015 – February 2019 TPS65917-Q1
The TPS65917-Q1 device includes several thermal monitoring functions for internal thermal protection of the PMIC.
The TPS65917-Q1 device integrates two thermal detection modules to monitor the temperature of the die. These modules are placed on opposite sides of the device and close to the LDO and SMPS modules. An over-temperature condition at either module first generates a warning to the system and then, if the temperature continues to rise, a switch-off of the PMIC device can occur before damage to the die.
Two thermal protection levels are available. One of these protections is a hot-die (HD) function which sends an interrupt to software. Software is expected to close any noncritical running tasks to reduce power. The second protection is a thermal shutdown (TS) function which immediately begins device switch-off.
By default, thermal protection is always enabled except in the BACKUP or OFF state. Disabling thermal protection in sleep state is possible for minimum power consumption.
To use thermal monitoring in the system do the following:
During operation, if the die temperature increases beyond HD_THR_SEL, an interrupt (INT1.HOTDIE) is sent to the host processor. Immediate action to reduce the PMIC power dissipation by shutting down some functions must occur.
If the die temperature of the PMIC device rises further (above 148°C), an immediate shutdown occurs. Indication of a thermal shutdown event indication is written to the status register,
INT1_STATUS_HOTDIE. The system cannot restart until the temperature falls below the HD_THR_SEL threshold.