SLVSD02E March 2015 – August 2021 TPS65982
Figure 12-3 shows the TPS65982 footprint using oval-shaped pads in specific locations. This allows the PCB designer to route the inner perimeter balls through the top layer. The balls around the perimeter have their pads in an oval shape with the exception of the corner balls. Figure 12-4 shows the sizing for the oval pads, 0.25 mm by 0.17 mm. All of the other non-oval shaped pads will have a 0.25 mm diameter. This footprint is recommended for MDI (Medium Density) PCB designs that are generally less expensive to build. The void under the TPS65982 allows for vias to route the inner signals and connect to the GND and power planes. Figure 12-5 shows the recommended minimum via size (8mil hole and 16 mil diameter). The recommended 8mil vias will be rated for approximately 1.8 A of DC current and 1.5 mΩ of resistance with 1.3 nH of inductance. Some board manufactures may offer 6mil hole and 12 mil diameter vias with a mechanical drill. This footprint is available for download on the TPS65982 product folder.