SGLS346A June   2006  – August 2025 TPS73201-EP , TPS73215-EP , TPS73216-EP , TPS73218-EP , TPS73225-EP , TPS73230-EP , TPS73233-EP , TPS73250-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2.     Power Dissipation Ratings
    3. 5.2 Electrical Characteristics
    4. 5.3 Typical Characteristics
  7. 6 Functional Block Diagrams
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1  Input and Output Capacitor Requirements
      2. 7.1.2  Output Noise
      3. 7.1.3  Board Layout Recommendation to Improve PSRR and Noise Performance
      4. 7.1.4  Internal Current Limit
      5. 7.1.5  Shutdown
      6. 7.1.6  Dropout Voltage
      7. 7.1.7  Transient Response
      8. 7.1.8  Reverse Current
      9. 7.1.9  Thermal Protection
      10. 7.1.10 Power Dissipation
      11. 7.1.11 Package Mounting
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1.10 Power Dissipation

The ability to remove heat from the die is different for each package type, presenting different considerations in the PCB layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Performance data for JEDEC low-K and high-K boards are shown in the Power Dissipation Ratings table. Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-holes to heat-dissipating layers also improves the heat-sink effectiveness.

Power dissipation depends on input voltage and load conditions. Power dissipation is equal to the product of the output current times the voltage drop across the output pass element (VIN to VOUT):

Equation 6. TPS73201-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73225-EP TPS73230-EP TPS73233-EP TPS73250-EP

Power dissipation can be minimized by using the lowest possible input voltage necessary to assure the required output voltage.