SBVS336A September   2021  – May 2022 TPS7A94

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Setting and Regulation
      2. 7.3.2 Ultra-Low Noise and Ultra-High Power-Supply Rejection Ratio (PSRR)
      3. 7.3.3 Programmable Current Limit and Power-Good Threshold
      4. 7.3.4 Programmable Soft Start (NR/SS Pin)
      5. 7.3.5 Precision Enable and UVLO
      6. 7.3.6 Active Discharge
      7. 7.3.7 Thermal Shutdown Protection (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
      4. 7.4.4 Current-Limit Operation
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Output Voltage Restart (Overshoot Prevention Circuit)
      2. 8.1.2  Precision Enable (External UVLO)
      3. 8.1.3  Undervoltage Lockout (UVLO) Operation
      4. 8.1.4  Dropout Voltage (VDO)
      5. 8.1.5  Power-Good Feedback (FB_PG Pin) and Power-Good Threshold (PG Pin)
      6. 8.1.6  Adjusting the Factory-Programmed Current Limit
      7. 8.1.7  Programmable Soft-Start and Noise-Reduction (NR/SS Pin)
      8. 8.1.8  Inrush Current
      9. 8.1.9  Optimizing Noise and PSRR
      10. 8.1.10 Adjustable Operation
      11. 8.1.11 Paralleling for Higher Output Current and Lower Noise
      12. 8.1.12 Recommended Capacitor Types
      13. 8.1.13 Load Transient Response
      14. 8.1.14 Power Dissipation (PD)
      15. 8.1.15 Estimating Junction Temperature
      16. 8.1.16 TPS7A94EVM-046 Thermal Analysis
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout
      2. 10.1.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DSC|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Load Transient Response

Note:

For best transient response, use the nominal value or larger capacitor from OUT to ground as listed in the Section 6.3 table. Place the output capacitor as close to the OUT and GND pins of the device as possible.

For best transient response and to minimize input impedance, use the nominal value or larger capacitor from IN to ground as listed in the Section 6.3 table. Place the input capacitor as close to the IN and GND pins of the device as possible.

The load-step transient response is the LDO output voltage response to load current changes. There are two key transitions during a load transient response: the transition from a light to a heavy load, and the transition from a heavy to a light load. The regions shown in Figure 8-17 are broken down in this section. Regions A, E, and H are where the output voltage is in steady-state regulation.

GUID-20210518-CA0I-RQD9-6Q9L-GBJQSNMTTK4C-low.gif Figure 8-17 Load Transient Waveform

During transitions from a light load to a heavy load:

  • The initial voltage dip is a result of the depletion of the output capacitor charge and parasitic impedance to the output capacitor (region B)
  • Recovery from the dip results from the LDO increasing its sourcing current, and leads to output voltage regulation (region C)

During transitions from a heavy load to a light load:

  • The initial voltage rise results from the LDO sourcing a large current, and leads to the output capacitor charge to increase (region F)
  • Recovery from the rise results from the LDO decreasing its sourcing current in combination with the load discharging the output capacitor (region G)

Transitions between current levels changes the internal power dissipation because the device is a high-current device (region D). The change in power dissipation changes the die temperature during these transitions, and leads to a slightly different voltage level. This temperature-dependent output voltage level shows up in the various load transient responses.

A larger output capacitance reduces the peaks during a load transient but slows down the response time of the device. A larger dc load also reduces the peaks because the amplitude of the transition is lowered and a higher current discharge path is provided for the output capacitor.