SLWS223B August   2011  – November 2015 TRF3705

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: General
    6. 6.6  Electrical Characteristics
    7. 6.7  Typical Characteristics: Single-Tone Baseband
    8. 6.8  Typical Characteristics: Two-Tone Baseband
    9. 6.9  Typical Characteristics: Two-Tone Baseband, Mid-Band Calibration
    10. 6.10 Typical Characteristics: No Baseband
    11. 6.11 Typical Characteristics: Two-Tone Baseband
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Gain Control Feature
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Baseband Inputs
        2. 8.2.2.2 LO Input
        3. 8.2.2.3 RF Output
        4. 8.2.2.4 350-MHz Operation
        5. 8.2.2.5 DAC to Modulator Interface Network
        6. 8.2.2.6 DAC348x with TRF3705 Modulator Performance
          1. 8.2.2.6.1 WCDMA
          2. 8.2.2.6.2 LTE
          3. 8.2.2.6.3 MC-GSM
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Definition of Specifications
        1. 11.1.1.1 Carrier Feedthrough
        2. 11.1.1.2 Sideband Suppression
        3. 11.1.1.3 Output Noise
        4. 11.1.1.4 Definition of Terms
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (October 2011) to B Revision

  • Added the ESD table, Detailed Description, Application and Implementation, Device and Documentation Support, Mechanical, Packaging, and Orderable InformationGo
  • Added Note 1 to Figure 65Go
  • Changed the X-axis label of Figure 75 From: Frequency (MHz) To: LO Power (dBm)Go
  • Changed Figure 77Go

Changes from * Revision (August 2011) to A Revision

  • Changed the device From: Preview To: ProductionGo