SLUSCV6A April   2017  – February 2018 UCC21225A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety-Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics and Thermal Derating Curves
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delay and Pulse Width Distortion
    2. 7.2 Rising and Falling Time
    3. 7.3 Input and Disable Response Time
    4. 7.4 Programable Dead Time
    5. 7.5 Power-up UVLO Delay to OUTPUT
    6. 7.6 CMTI Testing
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD, VCCI, and Under Voltage Lock Out (UVLO)
      2. 8.3.2 Input and Output Logic Table
      3. 8.3.3 Input Stage
      4. 8.3.4 Output Stage
      5. 8.3.5 Diode Structure in UCC21225A
    4. 8.4 Device Functional Modes
      1. 8.4.1 Disable Pin
      2. 8.4.2 Programmable Dead Time (DT) Pin
        1. 8.4.2.1 Tying the DT Pin to VCC
        2. 8.4.2.2 DT Pin Left Open or Connected to a Programming Resistor between DT and GND Pins
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Designing INA/INB Input Filter
        2. 9.2.2.2 Select External Bootstrap Diode and Series Resistor
        3. 9.2.2.3 Gate Driver Output Resistor
        4. 9.2.2.4 Estimate Gate Driver Power Loss
        5. 9.2.2.5 Estimating Junction Temperature
        6. 9.2.2.6 Selecting VCCI, VDDA/B Capacitor
          1. 9.2.2.6.1 Selecting a VCCI Capacitor
          2. 9.2.2.6.2 Selecting a VDDA (Bootstrap) Capacitor
          3. 9.2.2.6.3 Select a VDDB Capacitor
        7. 9.2.2.7 Dead Time Setting Guidelines
        8. 9.2.2.8 Application Circuits with Output Stage Negative Bias
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Certifications
      1. 12.2.1 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.3 Application Curves

Figure 39 and Figure 40 shows the bench test waveforms for the design example shown in Figure 35 under these conditions: VCC = 5 V, VDD = 12 V, fSW = 200 kHz, VDC-Link = 400 V.

Channel 1 (Indigo): UCC21225A INA pin signal.

Channel 2 (Cyan): UCC21225A INB pin signal.

Channel 3 (Magenta): Gate-source signal on the high side power transistor.

Channel 4 (Green): Gate-source signal on the low side power transistor.

In Figure 39, INA and INB are sent complimentary 3.3-V, 20%/80% duty-cycle signals. The gate drive signals on the power transistor have a 250-ns dead time, shown in the measurement section of Figure 39. The dead time matching is approximately 10-ns with the 250-ns dead-time setting. Note that with high voltage present, lower bandwidth differential probes are required, which limits the achievable accuracy of the measurement.

Figure 40 shows a zoomed-in version of the waveform of Figure 39, with measurements for propagation delay and rising/falling time. Importantly, the output waveform is measured between the power transistors’ gate and source pins, and is not measured directly from the driver OUTA and OUTB pins. Due to the split on and off resistors (Ron, Roff), different sink and source currents, and the Miller plateau, different rising (60, 120 ns) and falling time (25 ns) are observed in Figure 40.

UCC21225A fig39_SLUSCV6.gif
Figure 39. Bench Test Waveform for INA/B and OUTA/B
UCC21225A fig40_SLUSCV6.gif
Figure 40. Zoomed-In bench-test waveform