SLUSD49A September 2017 – January 2019 UCC256303
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | UCC25630 | UNIT | |
---|---|---|---|
D (SOIC) | |||
14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 74.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 30.7 | °C/W |
RθJB | Junction-to-board thermal resistance | 31.8 | °C/W |
ΨJT | Junction-to-top characterization parameter | 4.4 | °C/W |
ΨJB | Junction-to-board characterization parameter | 31.4 | °C/W |