SGLS245F May   2004  – April 2025 UCC2813-0-Q1 , UCC2813-1-Q1 , UCC2813-2-Q1 , UCC2813-3-Q1 , UCC2813-4-Q1 , UCC2813-5-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Detailed Pin Descriptions
        1. 7.3.1.1 COMP
        2. 7.3.1.2 CS
        3. 7.3.1.3 FB
        4. 7.3.1.4 GND
        5. 7.3.1.5 OUT
        6. 7.3.1.6 RC
        7. 7.3.1.7 REF
        8. 7.3.1.8 VCC
      2. 7.3.2  Undervoltage Lockout (UVLO)
      3. 7.3.3  Self-Biasing, Active Low Output
      4. 7.3.4  Reference Voltage
      5. 7.3.5  Oscillator
      6. 7.3.6  Synchronization
      7. 7.3.7  PWM Generator
      8. 7.3.8  Minimum Off-Time Adjustment (Dead-Time Control)
      9. 7.3.9  Leading Edge Blanking
      10. 7.3.10 Minimum Pulse Width
      11. 7.3.11 Current Limiting
      12. 7.3.12 Overcurrent Protection and Full-Cycle Restart
      13. 7.3.13 Soft Start
      14. 7.3.14 Slope Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 UVLO Mode
      3. 7.4.3 Soft-Start Mode
      4. 7.4.4 Fault Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Bulk Capacitor Calculation
        2. 8.2.2.2  Transformer Design
        3. 8.2.2.3  MOSFET and Output Diode Selection
        4. 8.2.2.4  Output Capacitor Calculation
        5. 8.2.2.5  Current Sensing Network
        6. 8.2.2.6  Gate Drive Resistor
        7. 8.2.2.7  REF Bypass Capacitor
        8. 8.2.2.8  RT and CT
        9. 8.2.2.9  Start-Up Circuit
        10. 8.2.2.10 Voltage Feedback Compensation Procedure
          1. 8.2.2.10.1 Power Stage Gain, Zeroes, and Poles
          2. 8.2.2.10.2 Compensating the Loop
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Related Links
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MINMAXUNIT
VCC voltage(3)12V
VCC current30mA
OUT current±1A
OUT energy (capacitive load)20µJ
Analog inputsFB, CS, RC, COMP–0.36.3 or
VVCC + 0.3(4)		V
Power dissipation at TA < 25°CN package1W
D package0.65
Lead temperature, soldering (10 s)300°C
Junction temperature–55150°C
Storage temperature, Tstg–65150°C
(1) All voltages are with respect to GND. All currents are positive into the specified terminal.
(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 6.3. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) In normal operation Vcc is powered through a current limit resistor. The resistor must be sized so that the VCC voltage under all operating conditions is below 12 V but above the turnoff threshold. Absolute maximum of 12 V applies when VCC is driven from a low impedance source such that ICC does not exceed 30mA. Failure to limit VCC and ICC to these limits may result in permanent damage of the device.This is further discussed in the Section 8.3
(4) Whichever is smaller.